Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a SiO bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more C(O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more C(O)OX groups are C(O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).

A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Techniques regarding polymers with antimicrobial functionality are provided. For example, one or more embodiments described herein can regard a polymer, which can comprise a repeating ionene unit. The repeating ionene unit can comprise a cation distributed along a degradable backbone. The degradable backbone can comprise a terephthalamide structure. Further, the repeating ionene unit can have antimicrobial functionality.

The present disclosure generally pertains to novel water soluble oligomeric and polymeric additives derived from oligomeric and polymeric amines; esters or halides of twin tail alkyl group comprising acids with intervening quaternary ammonium groups; optionally and preferably hydrophilic group comprising compounds capable of reacting with primary, secondary or tertiary amino groups; and optionally hydrophobic group comprising compounds. The compounds of the invention are useful as additives for aqueous film forming foam agents, and can perform as partial or complete replacements for fluorosurfactants and/or fluorinated foam stabilizers in foams.

Techniques regarding polymers with antimicrobial functionality are provided. For example, one or more embodiments described herein can regard a polymer, which can comprise a repeating ionene unit. The repeating ionene unit can comprise a cation distributed along a degradable backbone. The degradable backbone can comprise a terephthalamide structure. Further, the repeating ionene unit can have antimicrobial functionality.

Synthesis of polyionenes with built-in degradable linkers through addition polymerization of a novel class of degradable A.sub.2-type monomers (d-A.sub.2), and their use as antimicrobial agents are disclosed. A library of biodegradable polyionenes and Gemini-surfactants made from d-A.sub.2 monomers are also disclosed. These materials have potent and broad spectrum of antimicrobial activity with high selectivity over mammalian cells.

There are provided herein, inter alia, cationic amphipathic polymers, complexes, and compositions comprising same, and methods for their use including for the delivery of therapeutic, diagnostic and imaging agents, including nucleic acids, into a cell. The complexes, compositions and methods may facilitate delivery and targeted release of the therapeutic, diagnostic and imaging agents to particular cell types and tissues.

Creping adhesives can include one or more crosslinked resins having the chemical formula (O), (P), or (Q), where R.sup.X can be a crosslinking moiety, each R.sup.Y can independently be a substituted or unsubstituted organic diyl moiety, and each A.sup. can independently be an anion. The creping adhesive can have a cylinder probe adhesion of about 100 gram-force to about 300 gram-force. The creping adhesive can have a peel adhesion of about 20 g/cm to about 110 g/cm.

Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a SiO bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more C(?O)OX groups are C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).

Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.