The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The purpose of the present invention is to provide a, polyimide film having high transparency and improved bending resistance against multiple times of bending, and a varnish capable of providing such a polyimide film. The varnish according to the present invention contains a polymer (α) and a solvent (β). The polymer (α) is polyimide or a polyimide precursor. The varnish further contains a typical metal element having an atomic weight of 26-201 except alkali metals and alkaline earth metals, or at least one metal element among transition metal elements having an atomic weight of 26-201 or less. At least one of the metal elements contained in the varnish is present in an amount of 0.05-500 ppm relative to the polymer (α).

A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (T.sub.g) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.

A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.

A polyimide precursor solution includes a polyimide precursor, an aqueous solvent containing dimethyl sulfoxide and water, and particles. The content of the dimethyl sulfoxide relative to the particles is within a range of 0.15 to 2.00 in terms of mass ratio.

The present disclosure provides a polyimide film prepared from a precursor composition containing a polyamic acid and an organic solvent and having a value of (first FWHMsecond FWHM)/(first FWHM+second FWHM) which is less than 0.4, a graphite sheet prepared from the polyimide film, and a method for preparing a graphite sheet.

A polymer being a product of reactants including a diamine and a monomer represented by Chemical Formula 1:

##STR00001##

wherein, in Chemical Formula 1, R.sup.1, R.sup.2, o, p, L.sup.1, A.sup.1, R.sup.a, m, and n are the same as defined in the detailed description.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.