A polyimide precursor includes a repeating unit of formulae (I) and (II):

##STR00001## where R1 and R3 are each a tetravalent group of a tetracarboxylic dianhydride residue, and R2 and R4 are respectively a divalent group of a residue of a first-type diamine and a divalent group of a residue of a second-type diamine. The first-type diamine is represented by formula (III), and the second-type diamine is represented by formula (IV). A resin composition including the polyimide precursor, a polyimide formed from the polyimide precursor, and use of the polyimide are also disclosed.

A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.

A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.

Polyimide binders and their polyamic precursors to be used for forming electrode structures are provided. The designed polyamic binder precursors are water-soluble, and the resulting polyimide binders are mechanically strong, electrochemically and thermally stable. The properties of polyimide binders have led to significant improvement in electrode compatibility towards new manufactural processes.

The present invention relates to a liquid crystal alignment composition for the preparation of a liquid crystal alignment film having enhanced alignment property and stability and exhibiting a high voltage holding ratio, a method for preparing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same.

A method for purification of a biphenol tetraacid composition includes contacting the biphenol tetraacid composition with a solvent including a C1-6 alcohol to form a slurry and isolating the purified biphenol tetraacid from the slurry. The biphenol tetraacid composition includes a biphenol tetraacid and a biphenol. A purified biphenol tetraacid composition is also described.

Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (T.sub.g) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature that is greater than 450° C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-μm film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.

An oligomer includes a repeating unit

##STR00001##

and a repeating unit

##STR00002##

or a combination thereof. The repeating number of the repeating unit (a) and the repeating number of the repeating unit (b1), (b2), or a combination thereof have a ratio of 1:1 to 20:1. Each Q is independently substituted or unsubstituted aliphatic group, cycloaliphatic group, aromatic group, or siloxane group. X can be

##STR00003##

and Y can be

##STR00004##

or a combination thereof, and Z can be

##STR00005##

or a combination thereof.

A positive photosensitive resin composition and, more specifically, a positive photosensitive resin composition includes an alkali-soluble polymer resin comprising a polyimide precursor comprising a specific chemical structure; a quinone diazide compound; and a solvent. The positive photosensitive resin composition is a suitable matter for next-generation flexible displays and semiconductor packages.

An insulated wire includes a conductor, and a flame-retardant insulation layer that includes a resin composition including a flame retardant and is arranged around the conductor, and a water-blocking layer that is arranged around the flame-retardant insulation layer and has a water absorption of not more than 0.5% at saturation. The thickness of the water-blocking layer is not less than 25 μm.