This banding band has a belt-like portion having a plurality of teeth on at least one surface thereof, and a securing portion positioned at one end of the belt-like portion, wherein the securing portion has a through-hole into which the other end of the belt-like portion can be inserted, and at least the belt-like portion comprises an amorphous resin having a glass transition temperature of 180° C. or higher.

The invention relates to nanohybrids that are gold nanorod J-aggregates having a broadened surface plasmonic resonance band, processes of making such gold nanorod J-aggregates and products comprising such gold nanorod J-aggregates. Such gold nanorod J-aggregates exhibit broad localized surface plasmonic reasonable range from 800 nm to 2000 nm.

Resin composition including an epoxy resin, an epoxy resin curing agent, and a polyimide resin including a specified structural unit provide a high yield after patterning.

A polyetherimide-based foam contains specific amounts of a nucleating agent and a polyetherimide having a weight average molecular weight of 30,000 to 80,000 grams per mole and a dispersity of 2.7 to 4.5. The foam has a density of 20 to 60 kilograms per meter3, and a closed cell content of 80 to 100 percent. The foam can be prepared by a method that combines the nucleating agent and polyetherimide with a blowing agent that includes specific amounts of acetone and methanol. Also described are articles that include the foam.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

Aerogel compositions, methods for preparing the aerogel compositions, articles of manufacture that include or are made from the aerogel compositions are described and uses thereof. The aerogels include a branched polyimide matrix with little to no crosslinked polymers.

A polyimide precursor composition according to an exemplary embodiment includes an imide precursor having an organic group derived from a cyclic ether group-containing compound. A polyimide film formed using the polyimide precursor composition has improved heat resistance and mechanical properties, and has high absorbance in a wavelength range in an ultraviolet region.

The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.