The present invention relates to a diazaspiro compound and a use thereof. The diazaspiro compound may be significantly advantageously used as a monomer for producing a polyimide film having excellent optical properties.

Disclosed are a polyimide-based film and a method of producing the same, and more particularly, a polyimide-based film having excellent surface evenness and suppressed waviness due to low Kc of 1.55 or less and a method of producing the same.

In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride to diamine that forms the polyimide is in a range of from 0.85:1 to 0.99:1, and the polyimide film has a T.sub.g of 400° C. or higher, a tensile modulus of 6.0 GPa or more, and a coefficient of thermal expansion of 15 ppm/° C. or less over a temperature range of 50 to 500° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

The present invention relates to the production of a polyimide precursor, whereby, by using an amide-based organic solvent having a positive-number partition coefficient (Log P) and a density of at most 1 g/cm3, an interaction between the organic solvent and polyamic acid, which is a polyimide precursor, may be mitigated, thereby enabling the decrease of the viscosity of a polyimide precursor solution, and thus enabling a polyimide precursor solution having high solid content and low viscosity to be obtained.

A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 μm to 50 μm inclusive and an average circularity of 0.970 or more; and a solvent.

A polyimide precursor solution includes a polyimide precursor having a glass transition temperature Tg of equal to or higher than 300° C. after imidization, an aqueous solvent containing water, an organic amine compound, and resin particles having a volume average particle size of equal to or less than 100 nm.

In a first aspect, an article includes a first polymer film layer and a second polymer film layer. The first polymer film layer includes a first polymer including a first imide group. The second polymer film layer includes a second polymer including a second imide group.

A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.

Polyimide binders and their polyamic precursors to be used for forming electrode structures are provided. The designed polyamic binder precursors are water-soluble, and the resulting polyimide binders are mechanically strong, electrochemically and thermally stable. The properties of polyimide binders have led to significant improvement in electrode compatibility towards new manufactural processes.