A graphene-based membrane and a method of producing the same are disclosed. The graphene-based membrane may include a graphene-polymer composite, wherein the graphene-polymer composite may consist of an amine functionalized graphene and a polymer containing an anhydride group as a linker for linking the amine functionalized graphene to the polymer. The graphene-based membrane may be constructed of a single-layer. A method may include reacting a polymer containing an anhydride with an amine functionalized graphene in presence of a solvent to form an intermediate product; and thermal imidizing the intermediate product to form a graphene grafted polymer composite for use in fabricating a graphene-based membrane.

Provided is a window cover film and a flexible display panel including the same. More particularly, a window cover film including a substrate layer and a hard coating layer and a flexible display panel including the same are provided.

A polymer having excellent liquid crystal alignment and electrical properties and thus is suitable for use as a liquid crystal alignment agent, a liquid crystal alignment agent including the same, a liquid crystal alignment film formed from the liquid crystal alignment agent, and a liquid crystal display device including the liquid crystal alignment film are provided.

To provide polyimide films that contain polyimide good in solubility in solvent and excel lent in workability and that are colorless, transparent and excellent in toughness, polyimide varnishes, and products and layered products using the polyimide film, the polyimide film is characterized by containing polyimide expressed by following general formula (1), and containing as A in the general formula (1), a structure expressed by following general formula (A-1), for example, structure expressed by following general formula (A-5). ##STR00001## Herein, in the general formula (1), A represents a bivalent organic group, B represents a tetravalent organic group, and n is 2 or more. ##STR00002##

A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.

Embodiments of the present disclosure provide compounds derived by Troger's amine as shown below, microporous structures, membranes, methods of making said compounds, structures, and membranes, methods of use for gas separation, and the like (Formula A1).

The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. ##STR00001## In the formulas (1) and (2), n is an integer of 10 to 600, Ar.sub.1 is a tetravalent organic group; Ar.sub.2 is a divalent to tetravalent organic group; Ar.sub.3 is a divalent aromatic group; and R.sub.1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.

A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 m, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 m.

A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 m. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.