The present disclosure provides a polyimide polymer, which includes a repeating unit represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a polyimide mixture and a polyimide film, wherein the polyimide mixture is prepared by the polyimide polymer, and the polyimide film is prepared by the polyimide mixture.

The present invention relates to a method for the synthesis of a two-dimensional or quasi-two-dimensional polymer comprising a surfactant, the two-dimensional or quasi-two-dimensional polymer film and the use for the production of membranes, electronic devices or catalysts.

Provided are a polyimide compound including a repeating unit having an aromatic diamine component having a specific structure in which a side-chain benzylic position is regioselectively brominated, a gas separation membrane having a gas separation layer containing the polyimide compound, and a gas separation module and a gas separation apparatus each having the gas separation membrane.

The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water. The separation membrane of the present invention includes a metal organic framework. On the separation membrane, at least one of requirements (i) and (ii) below holds: (i) a ratio R1 of a number N2 of molecules satisfying a specified condition (b) with respect to a number N1 of molecules satisfying a specified condition (a) is less than 0.29; (ii) a ratio R2 of an adsorption amount of water adsorbed by the metal organic framework under water vapor at 25° C. and 3.2 kPa with respect to an adsorption amount of ethanol adsorbed by the metal organic framework under an ethanol atmosphere at 25° C. and 7.4 kPa is more than 4.0.

In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride to diamine that forms the polyimide is in a range of from 0.85:1 to 0.99:1, and the polyimide film has a T.sub.g of 400° C. or higher, a tensile modulus of 6.0 GPa or more, and a coefficient of thermal expansion of 15 ppm/° C. or less over a temperature range of 50 to 500° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

A photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C.

A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad laminate using the polyamic acid are also provided.

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

Disclosed are compositions and methods of preparing ionic polyimides. Also disclosed are methods to tune the properties of the ionic polyimide by designing the components of the ionic polyimide. Additionally, disclosed herein is a composition comprising an ionic polyimide. Also disclosed herein is a composition comprising an ionic polyimide and an ionic liquid. The disclosed compositions can be utilized to capture gases.

Embodiments of the present disclosure provide for an aromatic dianhydride, a method of making an aromatic dianhydride, an aromatic dianhydride-based polyimide, a method of making an aromatic dianhydride-based polyimide, and the like.