Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).

Provided is a resin composition having high thermal resistance and low dielectric properties, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a cyanate ester compound (B) containing two or more aromatic moieties per molecule, the aromatic moieties being replaced by at least one cyanato group: where in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula

##STR00001## wherein R.sub.1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R.sub.2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) ##STR00001##
RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.

The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) ##STR00001##
RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.

Branched amorphous polyamide (co)polymers having a backbone formed by reacting a reaction mixture including at least 25 mol % of a di-amine selected from a secondary di-amine, a branched di-amine, or a combination thereof; and an aliphatic acid blend including a branched aliphatic dimer acid and a branched aliphatic trimer acid. The molar equivalent ratio of the di¬ amine to the aliphatic acid blend is 0.9-1.1. Preferably, the branched amorphous polyamide (co)polymer is not telechelic. The branched amorphous polyamide (co)polymer preferably exhibits one or more of a shear modulus of from 10,000 to 500,000 Pa at 70° C., a complex viscosity of greater than 1,000,000 mPa*s at 70° C., a glass transition temperature of less than 25° C., or a number average molecular weight of greater than 10,000 Da. Biodegradable and/or compostable adhesive articles including the branched amorphous polyamide (co)polymer also are disclosed.