A monomer represented by Chemical Formula 1: ##STR00001##
wherein, in Chemical Formula 1, R.sup.1, R.sup.2, A.sup.1, A.sup.2, L.sup.1, L.sup.2, o, p, q, and r are the same as defined in the detailed description.

There is provided a polyamide-imide resin film including a polyamide-imide block copolymer having a specific structure and having a predetermined retardation.

There is provided a polyamide-imide resin film including a polyamide-imide block copolymer having a specific structure and having a predetermined retardation.

Provided is an antistatic polyimide-based film. More particularly, as an antistatic polyimide-based film for a window cover for protecting a surface of a display device, a window cover film having a protective film formed on the polyimide-based film provides an improvement to a problem of not being used as a film for a display window cover because a portion of the protective film remains on a base layer or a hard coating layer without being peeled off due to static electricity in the protective film or the base layer, or a hard coating layer, or the hard coating layer is peeled off with some or all of the protective film when the protective film is peeled off.

Provided is an antistatic polyimide-based film. More particularly, as an antistatic polyimide-based film for a window cover for protecting a surface of a display device, a window cover film having a protective film formed on the polyimide-based film provides an improvement to a problem of not being used as a film for a display window cover because a portion of the protective film remains on a base layer or a hard coating layer without being peeled off due to static electricity in the protective film or the base layer, or a hard coating layer, or the hard coating layer is peeled off with some or all of the protective film when the protective film is peeled off.

A reactive oligomer has a backbone derived from at least one of polyamideimide, polyimide, polyetherimide, polyaryletherketone, polyethersulfone, polyphenylene sulfide, polyamide, polyester, polyarylate, polyesteramide, polycarbonate, polybenzoxazole or polybenzimidazole and functionalized with at least one unreacted functional group capable of thermal chain extension and crosslinking after formation of the reactive oligomer, wherein the reactive oligomer has an M.sub.n of about 250 to about 10,000 g/mol, calculated using the Carothers equation. Compositions comprising the reactive oligomer have at least one other component that includes a second reactive oligomer, an oligomer lacking unreacted functional groups capable of thermal chain extension and crosslinking, a thermoplastic polymer, a thermoplastic polymer having the same backbone repeat units as the reactive oligomer, a filler, or an additive. A method of manufacture of an article comprises heating a composition comprising the reactive oligomer at a sufficient temperature and time to shape and crosslink the reactive oligomer, including additive manufacturing.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.