The present invention provides a resin composition comprising the following resin (a) and filler particles. The use of this composition makes it possible to obtain a separator having excellent heat resistance. Resin (a): a copolymer comprising a structural unit represented by a formula (1) and a structural unit represented by a formula (2), ##STR00001##
wherein M.sup.n+ represents a metal ion, and n represents the valence thereof, ##STR00002##

An alignment film composition includes a copolymer of a dianhydride-based compound and a diamine-based compound, and a cross-linker. The copolymer has a structure represented by Chemical Formula Ia or Chemical Formula Ib, and the cross-linker is represented by Chemical Formula IIa or Chemical Formula IIb:

##STR00001##

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

A polyimide, a film composition, and film prepared from the same are provided. The polyimide is a product of a reactant (a) and a reactant (b). The reactant (a) consists of a first dianhydride and a second dianhydride. The first dianhydride has a structure represented by Formula (I) and the second dianhydride has a structure represented by Formula (II)

##STR00001##

wherein R.sup.1, R.sup.2 and Ar.sup.1 are as defined in specification. The reactant (b) includes a first diamine, wherein the first diamine is

##STR00002##

and R.sup.3, R.sup.4, R.sup.5, or R.sup.6 are as defined in specification.

A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II)

##STR00001##

wherein A.sup.1 is C.sub.24-48 alkylene, C.sub.24-48 alkenylene, C.sub.24-48 alkynylene, C.sub.24-48 alicyclic alkylene, C.sub.24-48 alicyclic alkenylene, or C.sub.24-48 alicyclic alkynylene. A.sup.2 and A.sup.4, independently having at least one reactive group, are independently C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl; and, A.sup.3 is substituted or unsubstituted C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl.

The present specification relates to a polyimide resin, a positive-type photosensitive resin composition, an insulating film and a semiconductor device.

The present invention relates to a liquid crystal aligning agent composition including a terminal modifier of a specific chemical structure together with a polyimide or a precursor polymer thereof.

The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.

A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.