Provided is a liquid crystal aligning agent composition including a liquid crystal polymer together with a polyimide-based (co)polymer, a method for preparing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same.

A process to prepare an amine-functional ester of an amino carboxylic acid includes the step of reacting a polyol of the formula (I)

HO-A-OH  (I)

where A is a carbon chain with about 2 to about 36 carbon atoms that is aliphatic linear or branched, saturated or unsaturated, or aromatic, or CH.sub.2CH(OH)CH.sub.2, CH.sub.2C(CH.sub.2OH).sub.2CH.sub.2, CH.sub.2C(CH.sub.2OH)(CH.sub.3)CH.sub.2, CH.sub.2C(CH.sub.2OH)(CH.sub.2CH.sub.3)CH.sub.2, p-tetrahydrofuran, erythritol or an ester of di- or tricarboxylic acids with ethylene or propylene glycol, and wherein A can optionally be alkoxylated or reacted with hydroxy carboxylic acids, with an aminocarboxylic acid of formula II or its cyclic amide of the formula III, where m is an integer of about 1 to about 8 in formula II and about 3 to about 8 in formula III, each R independently is hydrogen or a C1-C4 alkyl group, or CH.sub.2CH.sub.2COOH, or CH.sub.2COOH, or (CH.sub.2).sub.4NH.sub.2, in the presence of a Brønsted-Lowry acid.

The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.

A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.

A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.