An adhesive matrix and adhesive formulation are described. The adhesive matrix is comprised of a hydrophilic domain and a hydrophobic domain, and a therapeutically active agent contained in the matrix in a supersaturated, stable, condition. The hydrophilic domain and the hydrophobic domain are co-soluble in a solvent system, to provide a homogeneous blend in which the active agent is solubilized. The proportion of the hydrophilic domain and hydrophobic domain is selected to optimize, or maximize, solubility of active agent in the matrix.

A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; (ii) a cyclic siloxane; and (iii) (iii) at least one of (A)(iii) (a) a branched organopolysiloxane having a particular formula or (A)(iii)(b) a terminating agent; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; (ii) a cyclic siloxane; and (iii) (iii) at least one of (A)(iii) (a) a branched organopolysiloxane having a particular formula or (A)(iii)(b) a terminating agent; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

The purpose of the present invention is to provide a curing catalyst that is highly stable and has a practical curing speed. The present invention provides a curing catalyst [B] used for curing a polymer [A] that has a reactive hydrolyzable silicon-containing group. The curing catalyst [B] contains the reaction products of a metal alkoxide [B1] and an ammonium hydroxide [B2]. The metal alkoxide [B1] includes one or both of a titanium compound [B1a] that is represented by chemical formula (1), and another metal alkoxide [B1b]. The other metal alkoxide [B1b] is an alkoxide of a metal other than titanium, and the ammonium hydroxide [B2] is represented by chemical formula (2).

The purpose of the present invention is to provide a curing catalyst that is highly stable and has a practical curing speed. The present invention provides a curing catalyst [B] used for curing a polymer [A] that has a reactive hydrolyzable silicon-containing group. The curing catalyst [B] contains the reaction products of a metal alkoxide [B1] and an ammonium hydroxide [B2]. The metal alkoxide [B1] includes one or both of a titanium compound [B1a] that is represented by chemical formula (1), and another metal alkoxide [B1b]. The other metal alkoxide [B1b] is an alkoxide of a metal other than titanium, and the ammonium hydroxide [B2] is represented by chemical formula (2).

The present disclosure relates to microcapsules, methods of using such microcapsules in the delivery of drugs and probiotic microbes to subjects in need thereof, and methods of using such microcapsules for in vitro culture of microbes. In particular, the microcapsules comprise novel siloxane-based membranes that maintains transport properties essential to communication and growth of microbes.

The present disclosure relates to microcapsules, methods of using such microcapsules in the delivery of drugs and probiotic microbes to subjects in need thereof, and methods of using such microcapsules for in vitro culture of microbes. In particular, the microcapsules comprise novel siloxane-based membranes that maintains transport properties essential to communication and growth of microbes.

Provided is a catalyst which comprises a compound represented by formula (1) and which exhibits activity for at least one type of reaction selected from among hydrosilylation reaction or hydrogenation reaction with respect to an aliphatic unsaturated bond and hydrosilane reduction reaction with respect to a carbon-oxygen unsaturated bond or a carbon-nitrogen unsaturated bond. Formula (1): M.sub.n(L.sub.m) {M represents Fe, Co, or Ni having an oxidation number of 0, L represents an isocyanide ligand represented by formula (2), n denotes an integer of 1-8, and m denotes an integer of 2-12. Formula (2): (CN).sub.x—R.sup.1 (R.sup.1 represents a mono- to trivalent-organic group having 1-30 carbon atoms, optionally being substituted by a halogen atom, and optionally having interposed therein one or more atoms selected from among O, N, S, and Si; and x denotes an integer of 1-3.)}.