C08G77/24

HYDROGEN CARRIER COMPOUNDS

The present invention relates to siloxane hydrogen carrier compounds and to a method for producing hydrogen from said siloxane hydrogen carrier compounds.

OMNIPHOBIC COMPOSITIONS
20220389194 · 2022-12-08 ·

This disclosure generally relates to compositions with omniphobic properties, and methods of preparing the compositions thereof. The omniphobic compositions can be used as coatings to make omniphobic materials, which can be used to manufacture a variety of apparatuses such as wearable devices, e.g., hearing aids.

Water-repellent coating composition and water-repellent coating substrate coated therewith

A water-repellent coating composition, and particularly, a water-repellent coating composition having improved adhesion and durability by including a phosphoric acid or a phosphoric acid-based compound, is provided.

Water-repellent coating composition and water-repellent coating substrate coated therewith

A water-repellent coating composition, and particularly, a water-repellent coating composition having improved adhesion and durability by including a phosphoric acid or a phosphoric acid-based compound, is provided.

Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrode

The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.

Room-temperature-curable organopolysiloxane composition, structure, and method for assessing cured state of said composition

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

Room-temperature-curable organopolysiloxane composition, structure, and method for assessing cured state of said composition

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

SILICONE OIL TERPOLYMER FOR USE IN INTRAOCULAR LENS DEVICES
20220380552 · 2022-12-01 ·

A halosilicone oil in the form of an uncrosslinked terpolymer represented by the following Formula (I):

##STR00001##

is disclosed, wherein at least one block forming component includes a halogenated, preferably fluorinated, substituent such as 2,2,2-trifluoroethyl or 3,3,3-trifluoropropyl. In some implementations, at least one block forming component also includes an aryl group, such as phenyl, that raises the refractive index of the polymer. In some implementations, the halosilicone oil is incorporated into an intraocular lens.

SILICONE OIL TERPOLYMER FOR USE IN INTRAOCULAR LENS DEVICES
20220380552 · 2022-12-01 ·

A halosilicone oil in the form of an uncrosslinked terpolymer represented by the following Formula (I):

##STR00001##

is disclosed, wherein at least one block forming component includes a halogenated, preferably fluorinated, substituent such as 2,2,2-trifluoroethyl or 3,3,3-trifluoropropyl. In some implementations, at least one block forming component also includes an aryl group, such as phenyl, that raises the refractive index of the polymer. In some implementations, the halosilicone oil is incorporated into an intraocular lens.

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF

Provided is a thermally conductive silicone composition whose cured product exhibits no cracks and voids, and has a favorable thermal conductivity. The thermally conductive silicone composition contains: (A) an organopolysiloxane having at least two silicon atom-bonded aliphatic unsaturated hydrocarbon groups per each molecule, and having a kinetic viscosity of 10 to 1,000,000 mm.sup.2/s at 25° C.; (B) an organohydrogenpolysiloxane; (C) gallium and/or a gallium alloy that have a melting point of −20 to 70° C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100 pin; (E) a platinum group metal catalyst; (F) a palladium powder; and (G-1) an organopolysiloxane represented by the following general formula (1):

##STR00001## wherein R.sup.1 independently represents an aliphatic unsaturated bond-free substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R.sup.2 independently represents an alkyl group, an alkenyl group or an acyl group.