The present disclosure relates to use of an aqueous dispersion of siloxane for reducing grain puffing of a wood substrate and an article comprising an anti grain puffing coating. The article comprises (a) a wood substrate having at least one major surface; (b) an anti grain puffing coating directly applied on the major surface of the wood substrate, formed from an aqueous dispersion of siloxane; and (c) one or more coatings applied on the anti grain puffing coating, formed from an aqueous coating composition, wherein the siloxane contains one or more hydrophobic group and one or more hydrophilic group chemically bonded to its molecule skeleton; and wherein the siloxane has a particle size in the range of 5 to 100 nm.

The composition includes a polysiloxane having at least one of a phosphate or phosphonate group and an amino-functional compound having at least one silane group. The method includes treating the metal surface with a composition including a polysiloxane functionalized with at least one of a phosphate or phosphonate group. The method can include first treating the metal surface with a primer composition including an amino-functional compound having at least one silane group or including an amino-functional compound having at least one silane group in the composition with the polysiloxane. Certain polysiloxanes functionalized with at least one of a phosphate or phosphonate group are also described.

The composition includes a polysiloxane having at least one of a phosphate or phosphonate group and an amino-functional compound having at least one silane group. The method includes treating the metal surface with a composition including a polysiloxane functionalized with at least one of a phosphate or phosphonate group. The method can include first treating the metal surface with a primer composition including an amino-functional compound having at least one silane group or including an amino-functional compound having at least one silane group in the composition with the polysiloxane. Certain polysiloxanes functionalized with at least one of a phosphate or phosphonate group are also described.

An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): Y.sub.aR.sup.1.sub.bSiO.sub.(4-a-b)/2 wherein R.sup.1 is an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0<a≤2, 0<b≤3, and a≤b. The organosilicon compound is compatible with organopolysiloxanes and is useful as a photo-initiator for various types of photo-curable compositions.

An organopolysiloxane compound represented by average structural formula (1) is capable of imparting an electron beam curable resin with high antistatic properties, while having excellent antistatic performance durability.

##STR00001##

(In the formula, Z represents a single bond or a group having a functionality of 2-20 and containing an organopolysiloxane structure; R.sup.1 represents a single bond, or an unsubstituted or substituted alkylene group having 1-20 carbon atoms; each of R.sup.2 and R.sup.3 represents an unsubstituted or substituted alkyl group having 1-10 carbon atoms, or the like; Y represents a monovalent hydrocarbon group having a polymerizable reactive group; each of p and q represents a number of 1-10, with (p+q) being 2-20 in accordance with the valence of Z; and in cases where Z represents a single bond, p and q represent 1, A.sup.− represents an anion and Q.sup.+ represents a cationic group that is represented by one of formulae (2)-(4)

##STR00002##

(wherein each one of R.sup.4-R.sup.10 represents an alkyl group having 1-20 carbon atoms, or the like; each one of R.sup.11-R.sup.13 represents a hydrogen atom or the like; and * represents a bonding hand).)

An organopolysiloxane compound represented by average structural formula (1) is capable of imparting an electron beam curable resin with high antistatic properties, while having excellent antistatic performance durability.

##STR00001##

(In the formula, Z represents a single bond or a group having a functionality of 2-20 and containing an organopolysiloxane structure; R.sup.1 represents a single bond, or an unsubstituted or substituted alkylene group having 1-20 carbon atoms; each of R.sup.2 and R.sup.3 represents an unsubstituted or substituted alkyl group having 1-10 carbon atoms, or the like; Y represents a monovalent hydrocarbon group having a polymerizable reactive group; each of p and q represents a number of 1-10, with (p+q) being 2-20 in accordance with the valence of Z; and in cases where Z represents a single bond, p and q represent 1, A.sup.− represents an anion and Q.sup.+ represents a cationic group that is represented by one of formulae (2)-(4)

##STR00002##

(wherein each one of R.sup.4-R.sup.10 represents an alkyl group having 1-20 carbon atoms, or the like; each one of R.sup.11-R.sup.13 represents a hydrogen atom or the like; and * represents a bonding hand).)

A release agent includes a water-soluble silicone polymer and method for lubricating a die casting mold includes applying a release agent to an inner surface of the mold and injecting a molten metal into the mold, wherein the release agent includes a water-soluble silicone polymer.

A photo-curable organopolysiloxane composition is provided. The photo-curable organopolysiloxane composition comprises: (A) 100 parts by mass of a photo-curable organopolysiloxane; and (B) about 0.01 to about 5.0 parts by mass of an organosilicon compound having at least one photo-active organic group and having at most about 200 silicon atoms per molecule, wherein the organosilicon compound is activated when it is exposed to light of a wavelength of from 300 to 420 nm. The photo-curable organopolysiloxane composition exhibits good storage ability and can be cured by exposing light of a wavelength of from 300 to 420 nm, and can form a cured product exhibiting good transparency.

Nanopore devices including barriers using polymers with end groups, and methods of making the same, are provided herein. In some examples, a barrier between first and second fluids is provided. The barrier may be suspended by a barrier support defining an aperture. The barrier may include one or more layers suspended across the aperture and including molecules of a block copolymer. Each molecule of the block copolymer may include one or more hydrophilic blocks having an approximate length A and one or more hydrophilic blocks having an approximate length B. The hydrophilic blocks may form outer surfaces of the barrier and the hydrophobic blocks being located within the barrier. End groups may be coupled to ends of the hydrophilic blocks that form outer surfaces of the barrier. The end groups may have a different hydrophilicity than the hydrophilic blocks.

A release agent includes a water-soluble silicone polymer and method for lubricating a die casting mold includes applying a release agent to an inner surface of the mold and injecting a molten metal into the mold, wherein the release agent includes a water-soluble silicone polymer.