Patent classifications
C08G77/52
POLYMER, COMPOSITION, AND MOLDED ARTICLE
The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1):
##STR00001##
wherein X.sup.11 and X.sup.12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y.sup.11 is an oxygen atom or a sulfur atom; Rf.sup.11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.
POLYMER, COMPOSITION, AND MOLDED ARTICLE
The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1):
##STR00001##
wherein X.sup.11 and X.sup.12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y.sup.11 is an oxygen atom or a sulfur atom; Rf.sup.11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.
Temperature-resistant silicone resins
Methods and formulations for modified silicone resins of Formula (I) are presented: ##STR00001##
The R.sup.1, R.sup.2, and R.sup.3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).
Temperature-resistant silicone resins
Methods and formulations for modified silicone resins of Formula (I) are presented: ##STR00001##
The R.sup.1, R.sup.2, and R.sup.3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).
Method for preparing semiconductor nanocrystal siloxane composite resin composition
The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.
Method for preparing semiconductor nanocrystal siloxane composite resin composition
The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.
SEPARATION COMPOSITE MEMBRANE, SEPARATION MEMBRANE MODULE, SEPARATOR, COMPOSITION FOR FORMING SEPARATION MEMBRANE, AND METHOD OF PRODUCING SEPARATION COMPOSITE MEMBRANE
A separation composite membrane, including a porous support layer, and a separation layer provided on the porous support layer and contains the following polymer a1 and b1; a separation membrane module; a separator; and a composition for forming a membrane suitable for preparing the separation composite membrane.
Polymer a1: A polymer whose ratio of a permeation rate of carbon dioxide to a permeation rate of methane is 15 or greater, and the permeation rate of the carbon dioxide is smaller than that in the polymer b1 and which has a solubility parameter of 21 or greater
Polymer b1: A polymer whose permeation rate of carbon dioxide is 200 GPU or greater, and a ratio of the permeation rate of the carbon dioxide to methane is smaller than that in the polymer a1 and which has a solubility parameter of 16.5 or less
PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS
A white photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) a photoacid generator, and (C) a white pigment has a sufficient reflectivity, good reliability with respect to adhesion and crack resistance, resolution, flexibility, and light resistance.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND BLACK MATRIX
A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.
Silicone-modified polybenzoxazole resin and making method
A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R.sup.1 to R.sup.4 are a C.sub.1-C.sub.8 monovalent hydrocarbon group, m and n are integers of 0-300, R.sup.5 is C.sub.1-C.sub.8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X.sup.1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use. ##STR00001##