A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

A plastic bearing material of a bearing may include a block copolymer. The block copolymer may include structural blocks of two or more different polymers. A first polymer may include at least one of polyamide-imide and polybenzimidazole. A second polymer may include at least one of polydimethylsiloxane, methyl vinyl ether and polyisobutene. A method for manufacturing a plastic bearing material may include synthesizing a structural block of a first polymer and a structural block of a second polymer to define a block copolymer via a condensation reaction.

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows: ##STR00001## Wherein x=70-80, y=10-20. The structural formula of the phenolic-modified silicone rubber resin is shown as follows: ##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows: ##STR00001## Wherein x=70-80, y=10-20. The structural formula of the phenolic-modified silicone rubber resin is shown as follows: ##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

##STR00001##

A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

A method for producing a polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1)′ to (1-4)′ and prescribed polycarbonate constituent units, the method having a polymerization step for polymerizing a silane-based compound selected from among a prescribed diaryloxysilane compound, a prescribed dialkoxysilane compound and a prescribed silicon compound, a carbonate compound and a diol compound such as an aromatic diol compound or an alicyclic diol compound in the presence of a transesterification catalyst. The polymerization step is carried out in a molten state under reduced pressure while removing alcohols derived from the carbonate compound.

##STR00001##

A photosensitive resin composition, an organic light emitting display device, and method for manufacturing an organic light emitting device, the composition including a photosensitive compound; a solvent; and a silsesquioxane-based copolymer, the silsesquioxane-based copolymer being obtained by copolymerizing a compound represented by the following Chemical Formula 1 with at least one of a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3;

R.sub.1-R.sub.2—Si(R.sub.3).sub.3  [Chemical Formula 1]

R.sub.4—Si(R.sub.5).sub.3  [Chemical Formula 2]

Si(R.sub.6).sub.4.  [Chemical Formula 3]