A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.

A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.

A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.

The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1): ##STR00001##
wherein X.sup.11 and X.sup.12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y.sup.11 is an oxygen atom or a sulfur atom; Rf.sup.11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.

The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1): ##STR00001##
wherein X.sup.11 and X.sup.12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y.sup.11 is an oxygen atom or a sulfur atom; Rf.sup.11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.

Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1) ##STR00001##
(R.sup.1 is an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, R.sup.2 is a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.