This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.

The present invention relates to a method for the polymerization of cycloolefins by ring-opening metathesis. The reaction is carried out in the presence of at least one particular catalyst, selected from the ruthenium alkylidene complexes comprising at least one 1-aryl-3-cycloalkyl-imidazolin-2-ylidene ligand and mixtures thereof. The invention also relates to a kit for implementing this method.

The present invention is a hydrogenated cycloolefin ring-opening polymer comprising a repeating unit derived from tetracyclododecene, and a repeating unit derived from an additional norbornene-based monomer, the hydrogenated cycloolefin ring-opening polymer having a racemo diad ratio of 65% or more with respect to the repeating unit derived from tetracyclododecene, the hydrogenated cycloolefin ring-opening polymer having a weight average molecular weight (Mw) of 10,000 to 40,000, and a resin formed article obtained by forming the hydrogenated cycloolefin ring-opening polymer having a glass transition temperature of 140 to 165° C., a melt flow rate of 8 g/10 min or more as measured at a temperature of 280° C. under a load of 21.18 N, and a flexural strength of 60 MPa or more as measured by a flexural test at a test speed of 2 mm/min, and a resin formed article, and an optical member.

Embodiments of the present disclosure are directed towards using a carbon-Michael compound. As an example, a method of using a carbon-Michael compound to reduce heat transfer can include locating the carbon-Michael compound between a heat provider and a heat receptor, where the carbon-Michael compound is a reaction product of a multifunctional acrylate compound with a multifunctional Michael donor, and the heat provider has a temperature from 100 C to 290 C.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

An object of the invention is to provide an organic semiconductor element in which mobility is high, heat resistance is excellent, and variation of mobility is suppressed, and a manufacturing method thereof, to provide a novel compound that is suitable as an organic semiconductor, and to provide an organic semiconductor film in which mobility is high, heat resistance is excellent, and variation of mobility is suppressed and a composition for forming an organic semiconductor film that can suitably form the organic semiconductor film.

The organic semiconductor element according to the invention has an organic semiconductor layer containing a compound having a constitutional repeating unit represented by Formula 1 or 2 below.

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The present invention provides a method of forming N-hydroxysuccinimide ester-functionalized paracyclophane. The present method is carried out by adding 4-carboxyl-paracyclophane into N,N′-Dicyclohexylcarbodiimide (DCC) and N-Hydroxysuccinimide (NHS) to form N-hydroxysuccinimide ester-functionalized paracyclophane. The present invention further provides a chemical film on a substrate and a method of forming the same, wherein the chemical film includes N-hydroxysuccinimide ester-functionalized poly-para-xylylene.

The present invention relates to certain ring open metathesis polymerized (ROMP) polymers encompassing polycycloolefinic monomers and a certain of olefinic monomers having thermally labile functional group. More specifically, the present invention relates to ROMP polymers under mass polymerization conditions of a series of functionalized norbornene-type monomers and at least one other olefinic monomer containing a thermally labile functional group such as, ether, acetal, ester, and the like. This invention also relates to reaction compositions containing a series of functionalized norbornene-type monomers and at least one other olefinic monomer containing a thermally labile functional group such as, ether, acetal, ester, and the like, which undergo ring open metathesis polymerization to produce materials which are useful as flame retardant materials having a variety of applications.

An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R.sub.1, R.sub.2, R.sub.3, k, and X are as described herein.

##STR00001##

A ring-opened copolymer composition has a ring-opened copolymer containing structural unit derived from a norbornene compound represented by general formula (1) below and structural unit derived from a monocyclic olefin, wherein a content of a norbornene compound represented by general formula (1) is 1 ppm by weight or more and 1000 ppm by weight or less based on the ring-opened copolymer, ##STR00001## wherein R.sup.1 to R.sup.4 are each a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a substituent containing a halogen atom, a silicon atom, an oxygen atom or a nitrogen atom, and R.sup.2 and R.sup.3 may be bonded to each other to form a ring, and “m” is 0 or 1.