Patent classifications
C08J5/125
Metal-clad laminate, circuit board, and multilayer circuit board
A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.
Solvent Cement Formulations
Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
Solvent cement formulations
Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
Cylindrical shrink label and method for producing same
A cylindrical shrink label is provided with a heat-shrinkable label base material; and a joint formed by cylindrically forming the label base material so that the edges thereof overlap, and then solvent welding the inner surface of the outside edge, which is positioned on the outside of the cylinder, and the outer surface of the inside edge, which is positioned on the inside of the cylinder. A resin layer, which is soluble in a hot alkaline aqueous solution, is formed on the abovementioned inner surface and/or the abovementioned outer surface, which form the joint.
ADHESIVE AND METHOD OF BONDING TO RIGID SUBSTRATES
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.
POLYMER BONDING PROCESS
The present application provides compositions, methods of making the compositions, methods of using the compositions, and kits having instructions for using the compositions for providing a bond between synthetic polymers or between a synthetic polymer and another type of substrate.
ADHESIVE COMPOSITION AND HEAT-FUSIBLE MEMBER USING SAME
An adhesive composition having high room-temperature peel strength, high hot peel strength, and excellent adhesion, as well as excellent electrolyte resistance even when used for packaging materials for lithium ion batteries is provided, which contains an organic solvent, a polyolefin (A) that has an acidic group and/or an acid anhydride group and is soluble in the organic solvent, and an isocyanate compound, wherein the isocyanate compound comprises (B) a diisocyanate compound having a C4-7 hydrocarbon group and/or a derivative thereof, and (C) a diisocyanate compound having a C8-14 hydrocarbon group and/or a derivative thereof; and a heat-fusible member using the adhesive composition is also provided.
Polymer bonding process
The present application provides compositions, methods of making the compositions, methods of using the compositions, and kits having instructions for using the compositions for providing a bond between synthetic polymers or between a synthetic polymer and another type of substrate.
GAS BARRIER FILM AND METHOD FOR PRODUCING GAS BARRIER FILM
A gas barrier film has, in sequence, a support, an inorganic layer disposed on one surface side of the support, an adhesive layer disposed on a surface of the inorganic layer, and a resin layer disposed on a surface of the adhesive layer in which the adhesive layer has a thickness of 15 m or less, and the adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less. A method for producing a gas barrier film includes an inorganic layer deposition step and a bonding step in a vacuum.
Solvent Cement Formulations
Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.