A molded article of a carbon fiber composite material includes at least carbon fibers and a resin composition. The molded article of a carbon fiber composite material is characterized in that the surface roughness Ra thereof is 0.01-2 ?m and in that the tensile shear adhesive strength (F0) thereof when a metal has been adhered to the surface thereof via an adhesive layer that contains an epoxy compound and is 0.1-3 mm thick is 10-40 MPa.

An article is described comprising a first film layer comprising polylactic acid polymer (semicrystalline polylactic acid polymer; amorphous polylactic acid polymer; or a mixture thereof); a second (e.g. polyvinyl acetate) polymer having a Tg of at least 25? C.; plasticizer. In some embodiment, the film layer further comprises inorganic pigment and/or hydrolysis stabilizer. In other embodiments, the film has a net melting endotherm, ?H.sub.nm1, of less than 10 J/g. Also described are methods of making a graphic film.

The present disclosure provides a process comprising providing an isocyanate component A comprising a blend of (i) an aromatic isocyanate prepolymer and (ii) an aliphatic isocyanate prepolymer; providing a polyol component B comprising a blend of; (i) a phosphate-functional polyol, (ii) a polyether polyol, and (iii) an element selected from the group consisting of a polyurethane polyol, a polyester polyol and a combination thereof; mixing component A and component B to form a solventless adhesive (SLA) composition, wherein a weight ratio of component A to component B is from 2:1 to 1:1, the SLA composition having a pot life from 30 min to 60 min at 40 C; applying the SLA composition between a first film and a second film to form a raw laminate; and curing the raw laminate to form a laminate product.

A silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl group, at least one silicon-bonded hydrogen atom, and free of an alkenyl group, or a mixture of components (B-1) and (B-2) an organosiloxane having in a molecule at least one aryl group and at least one alkenyl group; (C) an acrylic compound or a methacrylic compound; (D) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule and free of an aryl group and an alkenyl group; and (E) a hydrosilylation reaction catalyst. The silicone rubber composition exhibits excellent adhesive properties with respect to diverse organic resins it comes into contact with during its cure, and at the same time possesses excellent mold-release properties with respect to metal dies used for its molding.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

A hot melt adhesive film for bonding an ethylene-vinyl acetate form and a rubber includes a hot melt adhesive film layer and a release film layer. The hot melt adhesive film layer is prepared by the following raw materials in parts by weight: a 20-50 parts by weight of polyethylene-ester copolymer, a 5-15 parts by weight of rubber, a 15-55 parts by weight of thermoplastic polyolefin, a 5-20 parts by weight of tackifier and a 5-30 parts by weight of auxiliary. The release film layer is releasably adhered to the hot melt adhesive film layer.

The present disclosure relates to a method of adhering a first part to a second part, wherein the first part and the second part are used for outdoor applications and comprise a thermoplastic or a thermosetting organic polymer. The present disclosure is also directed to a composite assembly comprising: a) a first part and a second part used for outdoor applications and comprising a thermoplastic or a thermosetting organic polymer; and b) a multilayer pressure sensitive adhesive foam tape as described in the present disclosure, wherein the first pressure sensitive adhesive layer is adhered to the first part, and the second pressure sensitive adhesive layer is adhered to the second part.

A roof structure comprises a roof membrane and a roof substrate. A first surface of the roof membrane is adhered to the roof substrate by a two component adhesive, the adhesive being capable of adhering the first surface of the roof membrane to the roof substrate without the use of a high VOC solvent. The two component adhesive includes a Michael donor and a Michael acceptor, and the Michael donor and the Michael acceptor react to form an adhesive film.

Some polymeric devices, as described herein, can be made of a first layer and a second layer bonded together with one or more microfluidic channels defined internal to the device. The first layer and the second layer may each include a substrate and a polymer bonded to the substrate. The two layers may be bonded through a polymer network that interpenetrates the polymers in the first and second layers. This disclosure also describes methods of bonding together polymeric articles. The methods include diffusing polymerizable monomers and radical forming initiators into the surfaces of one or both of the polymers, putting the surfaces into contact, and initiating polymerization to create a polymer network that interpenetrates the polymers.

Disclosed are thermoset/thermoplastic composites that include a thermoset component directly or indirectly bonded to a thermoplastic component via a crosslinked binding layer between the two. The crosslinked binding layer is bonded to the thermoplastic component via epoxy linkages and is either directly or indirectly bonded to the thermoset component via epoxy linkages. The composite can be a laminate and can provide a route for addition of a thermoplastic implant to a thermoset structure.