Patent classifications
C08J2325/08
MULTI-BLOCK COPOLYMER COMPOSITION OBTAINED BY MODIFICATION TREATMENT, AND FILM
A main purpose of the present invention is to provide a multi-block copolymer composition having good elasticity and excellent stress relaxation properties, as well as small tension set. The present invention achieves the purpose by providing a multi-block copolymer composition obtained by a modification treatment, the composition including a block copolymer B formed by introducing a functional group capable of forming a non-covalent bond to a block copolymer A; wherein the block copolymer A includes a block copolymer A1 having a specific primary structure and a block copolymer A2 having a specific primary structure, and the mass ratio (A1/A2) of the block copolymer A1 and the block copolymer A2 is 100/0 to 50/50.
Highly compliant non-silicone putties and thermal interface materials including the same
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.
ADDITIVE FOR EPOXY ADHESIVE AND EPOXY ADHESIVE COMPOSITION FOR CONSTRUCTION INCLUDING SAME
In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.
PROCESS FOR THE PRODUCTION OF FIBRE-REINFORCED-COMPOSITES
The invention relates a process for preparing a fibre-reinforced composite (K) comprising the following steps: (a) Providing at least one continuous fibrous reinforcement material (A); (b) Providing at least one matrix polymer composition (B) having melt volume-flow rate (MVR (220/10) according to ISO 1133) of 40 to 70 mL/10 min and a viscosity number VN (according to DIN 53726) of 45 to 75 ml/g; (c) Applying the at least one matrix polymer composition (B) to at least one surface of the at least one continuous fibrous reinforcement material (A) to obtain a layered arrangement; (d) Heating the layered arrangement obtained in step (c) to a first temperature (T1) sufficiently above the glass transition temperature (Tg) of the at least one substantially amorphous matrix polymer composition (B) to obtain a substantially liquid substantially amorphous matrix polymer composition (B); (e) Allowing the substantially liquid matrix polymer composition (B) to impregnate the at least one continuous fibrous reinforcement material (A); (f) Cooling the thus obtained polymer-impregnated continuous fibrous reinforcement material (A) to a second temperature (T2) below the glass transition temperature (Tg) of the at least one substantially amorphous matrix polymer composition (B) in order to obtain a fibre-reinforced composite (K); wherein substantially amorphous matrix polymer composition (B) is a thermoplastic styrene-based substantially amorphous matrix polymer composition (B) and wherein least one of the process steps (d) and/or (e) is carried out at a temperature in the range of 230 to 330 C.
Method for producing a fibre-composite made from amorphous, chemically modified polymers with reinforcement fibres
The invention relates to a method for producing a thermoplastic fibre composite containing a thermoplastic moulding compound (A) as a polymer-matrix (M), reinforcement fibres (B), and optionally additive (C). Said method comprises the following steps: i) flat structures (F) made from reinforcing fibres (B) treated with a silane sizing material are provided, ii) the flat structures (F) are placed in a thermoplastic molding compound (A) which comprises at least 0.3 mol %, with respect to components (A), of a chemically reactive functionality, iii) chemically reactive groups of the thermoplastic molding compound (A) are reacted in the polymer matrix (M) with the polar groups of the treated reinforcing fibres (B), iv) the at least one additive (C) is optionally incorporated v) cooling. Said method is particularly suitable for producing fibrous composites.
Polymeric sheets and articles wrapped therewith
A polymeric sheet having low density and comprising a low to non-existent amount of cyclic olefinic polymers (COP) and/or cyclic olefinic copolymers (COC). The overall density of the sheet may be lower than water. The sheet may be stretched and then heat shrinked onto an article. The sheet may be used as a label or package to wrap articles therewith.
Latex formulation with a multivalent metal ion
The present invention relates to composition and an article prepared by applying the composition to paper. The composition comprises an aqueous dispersion of acrylic or styrene acrylic polymer particles having a hard phase and a soft phase, wherein both phases comprise structural units of an specific acid monomer. The composition further includes sub-stoichiometric levels of a Zn.sup.++ or Zr.sup.++++ with respect to the carboxylic acid groups. The composition is useful as imparting block and tack resistance as a coating on paper.
FOAMABLE POLYSTYRENE RESIN PARTICLES, POLYSTYRENE PREFOAMED PARTICLES, FOAM-MOLDED ARTICLE, AND METHODS FOR PRODUCING THESE
A method for producing expandable polystyrene-based resin particles, the method including producing polystyrene-based resin particles that comprise a styrene-based monomer and a polysiloxane-containing macro monomer, and impregnating an expanding agent into the polystyrene-based resin particles to produce the expandable polystyrene-based resin particles. The production of the polystyrene-based resin particles comprises the simultaneous addition of an initiator and the polysiloxane-containing macro monomer. The initiator causes the generation of one or more of an alkoxy radical and a carbonate radical.
Cationomeric Polyolefin Compositions and Methods for Production and Use Thereof
Although polyolefin elastomers are widely employed commodity polymers, there are shortcomings of this class of polymers for certain applications. For example, the rheological properties of some polyolefin elastomers may be insufficient to provide the green strength or low shear viscosity necessary to form stable foams, or to provide sufficient viscosity modification effects when present in a solvent. Cationomeric modification of polyolefin elastomers may alleviate these difficulties. Such polyolefin elastomers may feature a random cationomeric polyolefin copolymer comprising at least a first monomer and a second monomer, in which the first monomer is a neutral monomer and the second monomer has a side chain bearing a cationic moiety. The polyolefin elastomers may be present in foamed polyolefin compositions comprising a gas component and/or in liquid compositions comprising a solvent in which the polyolefin elastomer is dissolved.
THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME
A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.