C08J2327/16

Decorative film for film insert molding and method for manufacturing same
11207872 · 2021-12-28 · ·

The present invention provides a decorative film for film insert molding, the decorative film having: a fluorine-based resin layer containing 100 to 80 parts by mass of a fluorine-based resin and 0 to 20 parts by mass of a methacrylic acid ester-based resin; an acrylic-based resin layer containing 50 to 0 parts by mass of a fluorine-based resin and 50 to 100 parts by mass of a methacrylic acid ester-based resin; and a decorative layer containing a thermoplastic resin, laminated therein in this order, wherein the fluorine-based resin layer has a thickness of 10 μm to 200 μm, and surface unevenness is formed on a surface of the fluorine-based resin layer, the surface being on the side that is not in contact with the acrylic-based resin layer. The present invention also provides a method for manufacturing the decorative film for film insert molding.

Gas barrier film and method for producing gas barrier film
11203180 · 2021-12-21 · ·

A gas barrier film has, in sequence, a support, an inorganic layer disposed on one surface side of the support, an adhesive layer disposed on a surface of the inorganic layer, and a resin layer disposed on a surface of the adhesive layer in which the adhesive layer has a thickness of 15 μm or less, and the adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less. A method for producing a gas barrier film includes an inorganic layer deposition step and a bonding step in a vacuum.

DISPERSIBLE IONOMER POWDER AND METHOD OF MAKING THE SAME
20210380741 · 2021-12-09 ·

The present invention relates to certain dispersible ionomer powders made of particles consisting in quasi-spherical hollow agglomerates of elementary particles, to a method for their manufacture involving spray-drying of a latex of said ionomer, and to methods of using the same, notably for coating applications.

FLUORORESIN COMPOSITION, AND RESIN SHEET, LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
20210380792 · 2021-12-09 ·

A fluororesin composition is provided. The fluororesin composition comprises the following constituents: (A) a first fluororesin, which is polytetrafluoroethylene (PTFE) resin; (B) a first filler, which is a flat glass fiber; and (C) particles of a second fluororesin, which are coated with polysiloxane,
wherein, the particle size of the polysiloxane-coated particles of second fluororesin ranges from 0.2 μm to 80 μm, and the melting point of the second fluororesin is lower than the melting point of the first fluororesin.

BINDER COMPOSITION, METHOD OF PRODUCING BINDER COMPOSITION, AND METHOD OF PRODUCING ALL-SOLID-STATE BATTERY

A binder composition includes a dispersion medium and a group of binder particles. The group of binder particles is dispersed in the dispersion medium. The group of binder particles include a polymer material. The polymer material includes a constitutional unit originated from vinylidene difluoride. The group of binder particles has a number-based particle size distribution. The particle size distribution satisfies the following conditions: “0.19≤X≤0.26”, “0.69≤Y≤0.76”, and “0≤Z≤0.05”. Here, “X” represents a frequency of particles each having a particle size of less than or equal to 40 μm. “Y” indicates a frequency of particles each having a particle size of more than 40 μm and less than or equal to 110 μm. “Z” indicates a frequency of particles each having a particle size of more than 110 μm and less than or equal to 250 μm.

Heat-resistant crosslinked fluorocarbon rubber formed body and method for producing the same, silane master batch, master batch mixture and formed body thereof, and heat-resistant product

A method for producing a heat-resistant crosslinked fluorocarbon rubber formed body, comprising: (a) a step of melt-kneading 0.003 to 0.5 part by mass of an organic peroxide, 0.5 to 400 parts by mass of an inorganic filler, and more than 2.0 parts by mass and 15.0 parts by mass or less of a silane coupling agent, with respect to 100 parts by mass of a base rubber containing a fluorocarbon rubber, at a temperature equal to or higher than a decomposition temperature of the organic peroxide, to prepare a silane master batch; a heat-resistant crosslinked fluorocarbon rubber formed body obtained by the method, a silane master batch, a mixture and a formed body thereof, and a heat-resistant product.

ORGANIC FIELD-EFFECT TRANSISTOR COMPRISING A DIELECTRIC LAYER EXHIBITING HIGH DIELECTRIC PERMITTIVITY AND BEING STABLE WITH TEMPERATURE

The invention relates to a composition comprising a blend of fluorinated electroactive polymers and having a dielectric permittivity that exhibits greater stability over the operating temperature range with respect to each polymer employed on its own. The invention also relates to formulations and films produced on the basis of said composition. The invention also relates to a field-effect transistor, at least part of the dielectric layer of which is composed of a blend of fluorinated electroactive polymers.

Electrolyte solution and method for producing same, continuously dissolving facility, electrolyte membrane, electrode catalyst layer, membrane electrode assembly and fuel cell

A method for producing an electrolyte solution including a supply step of continuously supplying an emulsion based a polymer electrolyte and a solvent into a dissolution facility, and a dissolution step of continuously dissolving the polymer electrolyte in the solvent by heating the interior of the dissolution facility to obtain the electrolyte solution.

Polyfluorene-based polymer-polyvinylidene fluoride graft copolymer and element including the same

Disclosed is a graft copolymer containing a polyfluorene-based polymer as a main chain and a polyvinylidene fluoride (PVDF) as a side chain, and an element including the same. The graft copolymer contains both the polyfluorene-based polymer and the PVDF, so that the graft copolymer may increase miscibility between polymers to prepare a composite having excellent performance, prepare an uniform thin film through a solution process, and be used as a single material that exhibits both piezoelectric properties and luminescence properties.

LEAD-FREE PIEZO COMPOSITES AND METHODS OF MAKING THEREOF

Methods of producing lead-free piezoelectric composites are described. The method can include adding a lead-free piezoelectric additive to a solution that includes a solvent and polymer solubilized therein. The solvent can have i) a boiling point ≤80° C. at 0.1 MPa and ii) a solubility in water of ≥0.1 g/g and/or a dielectric constant ≥20. The solvent can be removed to form a polymeric matrix having the lead-free piezoelectric particles dispersed therein. Electrical treatment of the polymeric matrix can form the piezoelectric component. Lead-free piezoelectric composites and devices that include the lead-free piezoelectric composites are also described.