Electronic telecommunication articles are described comprising a crosslinked fluoropolymer layer. In typical embodiments, the crosslinked fluoropolymer layer is a substrate, patterned (e.g. photoresist) layer, insulating layer, passivation layer, cladding, protective layer, or a combination thereof. Also describes are methods of making an electronic telecommunications article and method of forming a patterned fluoropolymer layer. The fluoropolymer preferably comprises at least 80, 85, or 90% by weight of polymerized units of perfluorinated monomers and cure sites selected from nitrile, iodine, bromine, and chlorine. Illustrative electronic communication articles include integrated circuits, printed circuit boards, antennas, and optical fiber cables. Fluoropolymer compositions are also described.

Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.

A foam and a foaming composition are provided. The foam includes a composite material and a plurality of foam cells, wherein the foam cells are disposed in the composite material. The composite material includes a modified sulfur-containing polymer and a fluorine-containing polymer fiber, wherein a degree of orientation as defined by the ratio I.sub.110/I.sub.200 is from 1.0 to 1.3, wherein I.sub.110 is the X-ray diffraction peak intensity of (110) planes of the modified sulfur-containing polymer and I.sub.200 is the X-ray diffraction peak intensity of (200) planes of the modified sulfur-containing polymer.

The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

A supported elastomeric foam (100) includes an elastomeric matrix (102) formed of an elastomer and including a reinforcement region (104) and a foamed region (106). The foamed region includes gas filled cells (108) in the elastomer, and the reinforcement region includes a porous layer (204) having an interconnected network of pores at least partially imbibed with the elastomer. The foam can include an adhesive at a surface of the foam. A compressible seal (802) including a compressible body, which can be elastomeric foam, can also include a pattern of discontinuous adhesive regions about which the compressible body can deform to form a sea. The supported elastomeric foam can form a gas tight seal in an interface when placed under minimal compression.

Powder including low molecular weight polytetrafluoroethylene having a melt viscosity of 1×10.sup.2 to 7×10.sup.5 Pa.Math.s at 380° C., having a melt viscosity of 1×10.sup.2 to 7×10.sup.5 Pa.Math.s at 380° C., having an average particle size of 1.0 to 50 μm, and containing 30 or more carboxyl groups at ends of the molecule chain per 10.sup.6 carbon atoms in the main chain, wherein the powder is substantially free from C8-C14 perfluorocarboxylic acids and salts thereof.

The present invention pertains to a fluoropolymer film comprising at least one fluoropolymer hybrid organic/inorganic composite [polymer (FH)], to a process for the manufacture of said fluoropolymer film and to uses of said fluoropolymer film in various applications, in particular in electrochemical applications.

The present invention provides 1,3,3,3-tetrafluoropropene (HFO-1234ze) copolymers comprising 1,3,3,3-tetrafluoropropene and one or more comonomers selected from the group consisting of vinyl fluoride (VF), vinylidene fluoride (VF.sub.2), tetrafluoroethylene (TFE), chlorotrifluoroethylene (CTFE), hexafluoropropylene (HFP), and perfluoro(alkyl vinyl ether) (PAVE), wherein said alkyl contains 1 to 5 carbon atoms, the copolymers being a fluoroplastic or a fluoroelastomer, depending upon monomer content.

An anion exchange membrane is made by mixing 2 trifluoroMethyl Ketone [nominal] (1.12 g, 4.53 mmol), 1 BiPhenyl (0.70 g, 4.53 mmol), methylene chloride (3.0 mL), trifluoromethanesulfonic acid (TFSA) (3.0 mL) to produce a pre-polymer. The pre-polymer is then functionalized to produce an anion exchange polymer. The pre-polymer may be functionalized with trimethylamine in solution with water. The pre-polymer may be imbibed into a porous scaffold material, such as expanded polytetrafluoroethylene to produce a composite anion exchange membrane.

The invention provides a laminate including a fluoroelastomer layer and a fluororesin layer which are firmly bonded to each other. The laminate includes a fluoroelastomer layer (A) and a fluororesin layer (B) stacked on the fluoroelastomer layer (A). The fluoroelastomer layer (A) is a layer formed from a fluoroelastomer composition. The fluoroelastomer composition contains a fluoroelastomer, a basic multifunctional compound, and at least one compound (a) selected from the group consisting of a fluororesin (a1) and a phosphorus compound (a2). The compound (a) is present in an amount of 0.01 to 120 parts by mass relative to 100 parts by mass of the fluoroelastomer. The fluororesin layer (B) is formed from a fluororesin (b1) having a fuel permeability coefficient of 2.0 g.Math.mm/m.sup.2/day or lower.