The embodiments relate to a polymerizable thermoset composition having improved flame retardant properties, a polymerized thermoset having improved flame retardant properties, a process for manufacturing the polymerized thermoset, and use of the polymerizable thermoset composition to produce lightweight construction components, preferably carbon fiber composites (CFRP), and a lightweight construction component, preferably carbon fiber composite (CFRP), containing the polymerized thermoset.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

The embodiments relate to a polymerisable thermoset composition having improved flame retardant properties, a polymerised thermoset having improved flame retardant properties, a process for manufacturing the polymerised thermoset, and use of the polymerisable thermoset composition to produce lightweight construction components, preferably carbon fibre composites (CFRP), and a lightweight construction component, preferably carbon fibre composite (CFRP), containing the polymerised thermoset.

The present invention provides a resin composition containing (A) one or more selected from the group consisting of a maleimide resin having one or more N-substituted maleimide groups and a derivative of the maleimide resin, and (B) a compound having a vinyl benzyl group, in which the component (B) contains one or more selected from the group consisting of (B1) a compound having 3 or more vinyl benzyl groups bonded to an oxygen atom and (B2) a compound having one or more vinyl benzyl groups bonded to a carbon atom, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package in which the resin composition is used.

A method of reducing the formaldehyde emission of a mineral fiber product bonded with a urea-modified phenol-formaldehyde resol resin-type binder comprises adding dextrose to the binder composition during and/or after preparation of the binder composition but before curing of the binder composition applied to the mineral fibers.

The present invention provides a curable resin having excellent dielectric properties, a curable resin composition, and cured products thereof. The present invention specifically provides a curable resin which is represented by formula (1). In formula (1), A represents any of the following formulas (1-a) to (1-d). The plurality of X each independently represent any of the following formulas (1-e) to (1-g). The plurality of R.sub.1 each independently represent a residue obtained by removing one hydrogen atom from a C9 petroleum resin. The plurality of R.sub.2 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an amino group, or a hydroxy group. The plurality of s and t are each independently an integer of 0 to 3, and the total of s, which is the number of R.sub.1 moieties, and t, which is the number of R.sub.2 moieties, the moieties being bonded to the same aromatic ring, is an integer of 0 to 3. The average value of s s.sub.ave satisfies 0<s.sub.ave3, and the average value of t t.sub.ave satisfies 0t.sub.ave2. n is the average number of repetitions and satisfies 0.1n5.

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