The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be

##STR00001##

or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen

##STR00002##

or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is

##STR00003##

wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is

##STR00004##

wherein e is 0-10.

This invention generally relates to transparent compositions containing a blend of poly(phenylene ether) and styrenic polymer, methods for their manufacture, and food packaging films and containers derived therefrom.

A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a D.sub.f of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

A membrane electrode assembly for fuel cells includes a proton conducting membrane having a first side and a second side. The proton conducting membrane in turn includes a first polymer including cyclic polyether groups and a second polymer having sulfonic acid groups. The membrane electrode assembly further includes an anode disposed over the first side of the proton conducting layer and a cathode catalyst layer disposed over the second side of the proton conducting layer.

The present specification relates to a sulfonate-based compound and a polymer electrolyte membrane using the same, a membrane electrode assembly including the same, and a fuel cell including the same.

This disclosure describes micro, sub-micro, and nano-cellular polymer foams formed from a polymer composition that includes a polymer and functionalized carbon nanotubes, and systems and methods of formation thereof. The microcellular polymer foam has an average pore size within a range of 1 micron to 100 microns, the sub-microcellular polymer foam has an average pore size within a range of 0.5 microns to 1 micron, and the nano-cellular polymer foam has an average pore size within a range of 10 nanometers to 500 nanometers. In other aspects, this disclosure describes micro, sub-micro, and nano-cellular polymer foams formed from a polymer composition that includes a polymer and non-functionalized carbon nanotubes.

A porous membrane is made from a poly(phenylene ether) copolymer containing 10 to 40 mole percent repeat units derived from 2-methyl-6-phenylphenol and 60 to 90 mole percent repeat units derived from 2,6-dimethylphenol; and a block copolymer containing backbone or pendant blocks of poly(C.sub.2-4 alkylene oxide). The porous membrane is made by dissolving the poly(phenylene ether) copolymer in a water-miscible polar aprotic solvent to form a membrane-forming composition; and phase-inverting the membrane forming-composition in a first non-solvent composition to form the porous membrane. A method of making a hollow fiber by coextrusion through a spinneret having an annulus and a bore, includes coextruding the membrane-forming composition through the annulus, and a first non-solvent composition through the bore, into a second non-solvent composition to form the hollow fiber.