A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant. ##STR00001##

Provided is a foamable polyamide composition comprising a) at least one polyamide comprising at least one carboxylic group; b) at least one thermoplastic rubber; and c) at least one compound having at least one isocyanate group; and optionally d) at least one filler and e) at least one additive.

A resin composition contains a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the terminal, a maleimide compound (A) having an indane structure in the molecule, and an inorganic filler.

Provided herein are ionically conductive solid-state compositions that include ionically conductive inorganic particles in a matrix of an organic material. The resulting composite material has high ionic conductivity and mechanical properties that facilitate processing. In particular embodiments, the ionically conductive solid-state compositions are compliant and may be cast as films. In some embodiments of the present invention, solid-state electrolytes including the ionically conductive solid-state compositions are provided. In some embodiments of the present invention, electrodes including the ionically conductive solid-state compositions are provided. The present invention further includes embodiments that are directed to methods of manufacturing the ionically conductive solid-state compositions and batteries incorporating the ionically conductive solid-state compositions.

An additive for resin kneading contains an organic ultraviolet absorber and/or a radical scavenger, and a polymer having the organic ultraviolet absorber and/or the radical scavenger dispersed. The additive for resin kneading has a median size of 1 .Math.m or more and 100 .Math.m or less. A percentage of the total amount of the organic ultraviolet absorber and the radical scavenger in the additive for resin kneading is 20% or more and 70 % or less. The polymer is a copolymer of a vinyl monomer component that contains a monofunctional vinyl monomer containing only one polymerizable carbon-carbon double bond per molecule, and a polyfunctional vinyl monomer containing two or more polymerizable carbon-carbon double bonds per molecule. A percentage of the monofunctional vinyl monomer in the total amount of the monofunctional vinyl monomer and the polyfunctional vinyl monomer is 10% or more and 95% or less.

A composition comprises: a resin component including an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying all the following conditions (1) to (4): (1) a number average molecular weight of the copolymer is 500 or more and 100000 or less; (2) the aromatic vinyl compound monomer is an aromatic vinyl compound having 8 or more and 20 or less carbon atoms, and a content of a unit of the aromatic vinyl compound monomer is 0 mass % or more and 70 mass % or less; (3) the aromatic polyene is one or more selected from polyenes having 5 or more and 20 or less carbon atoms and having a plurality of vinyl groups and/or vinylene groups in the molecule, and a content of the vinyl groups and/or the vinylene groups derived from the unit of the aromatic polyene is 1.5 pieces or more and less than 20 pieces per number average molecular weight; and (4) the olefin is one or more selected from olefins having 2 or more and 20 or less carbon atoms, and a total of units of the olefin monomer, the aromatic vinyl compound monomer, and the aromatic polyene monomer is 100 mass %; and a surface-treated silica. The volume ratio between the resin component and the silica is in the range of 98 to 15:2 to 85. A cured product of the composition has a value of the dielectric tangent obtained by resonator method at a measurement frequency of 10 GHz and/or a measurement frequency range of 25 GHz to 40 GHz of 1.2×10.sup.−3 or less and a storage elastic modulus at 250° C. in the range of 10 MPa or more and 10 GPa or less.

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

A coated particle according to the present invention is a coated particle containing a conductive metal-coated particle having a metal film formed on a surface of a core material, the conductive metal-coated particle coated with an insulation layer containing a polymer, wherein the insulation layer has a phosphonium group. The insulation layer preferably contains an insulating fine particle and the fine particle has a phosphonium group on a surface thereof, or the insulation layer is preferably a film having a phosphonium group. In addition, the metal is preferably at least one selected from nickel, gold, nickel alloys, and gold alloys. The polymer constituting the insulation layer is preferably at least one polymerized product selected from styrenes, esters, and nitriles.

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.

A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.