To provide a composite porous film in which thermal shrinkage is satisfactorily suppressed even when temperature exceeds a melting temperature of a polyolefin resin, adhesion between a microporous membrane and a heat-resistant layer is improved, and dropout of an inorganic filler is suppressed. The composite porous film is composed of the heat-resistant layer formed of the inorganic filler and a binder, and the microporous membrane formed of the polyolefin resin, and the composite porous film having a primary particle size of the inorganic filler in the range of 5 nanometers to 100 nanometers.

The present invention relates to a process of fabricating P(VDF-TrFE) films by modifying the solvent composition. Two solvents MEK and DMSO were mixed in pre-determined ratios and that co-solvent mixture was used for fabricating the P(VDF-TrFE) films. By virtue of such method driven P(VDF-TrFE) films, the ferroelectric capacitors comprising of the same were found to achieve low voltage operation, thermal stability and fatigue endurance, which indicated improved ferroelectric performance of the devices. In addition, the films made by same process also yielded high piezo- and pyro-electric coefficient, indicating improved piezo- and pyro-electric performances of the devices.

Methods and materials used for production of constructs having a porous open or semi-open celled structure. Constructs may include a porous matrix as a base and a biocompatible conformal coating thereon.

A fluororesin film contains a fluororesin. The fluororesin contains two fluororesin species having different composition ratios of polymerized units. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 μm and an arithmetic average roughness of 0.010 to 0.050 μm, and the fluororesin film has a breakdown strength of 400 V/μm or higher.

Provided is a resin composition including 40 to 99% by mass of a fluorine-based resin (A), and 1 to 60% by mass of a matting agent (B), in which a swell ratio as measured under the conditions of a measurement temperature of 230° C., an ambient temperature of 23° C., and a shear rate of 96 (1/sec) is 0.90 to 2.00.

A light, flexible, and tough thin film having high total light transmittance that can be formed on various three dimensional shapes, and also provides a stably driven tactile sensor, which is an electronic device having the switching function thereof, is provided. The tactile sensor is formed on a polyimide thin film having high total light transmittance, thermal resistance, and a polar component of surface free energy with a specific value, and has a switching device that emits a voltage signal which, through an electronic circuit for controlling noise, stably drives another device. This tactile sensor has a curved or flat surface and has a first electrode, a ferroelectric layer, and a second electrode formed over the polyimide thin film. The switching device as a tactile sensor can drive another device merely by a light touch with a finger, and can be manufactured at a high non-defective rate.

A material comprising a silicone, wherein a polymer is arranged on the surface of the silicone, the polymer is characterized by a higher wear resistance than the silicone, and the polymer is attached to the surface of the silicone by non-covalent bonds.

The invention relates to a composition comprising a blend of fluorinated electroactive polymers and having a dielectric permittivity that exhibits greater stability over the operating temperature range with respect to each polymer employed on its own. The invention also relates to formulations and films produced on the basis of said composition. The invention also relates to a field-effect transistor, at least part of the dielectric layer of which is composed of a blend of fluorinated electroactive polymers.

A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 μm and an arithmetic average roughness of 0.010 to 0.050 μm. Further, the fluororesin film has a breakdown strength of 400 V/μm or higher.

A block copolymer is provided. The block copolymer includes a first block including repeat units represented by formula (I), and a second block connected to the first block and including repeat units represented by formula (II) or (III). The disclosure also provides a method for preparing the block copolymer and a thin film structure including the same.