A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350 C. to 250 C. via a lowering temperature rate of 1 to 4 C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

In an aspect, a method of making a composition, comprising forming a solvent mixture comprising a polymer and a solvent; precipitating the solvent mixture with a non-solvent to form the composition comprising the filler in a fibrillated polymer matrix, wherein the composition is in the form of a particulate and at least one of the solvent and the non-solvent comprises a filler; and separating the composition from the solvent and the non-solvent to isolate the composition. In another aspect, a porous material wherein the filler particles are mechanically bonded together by the polymer and wherein the polymer is present as filaments adhering to and connecting the filler particles across interstitial spaces between the filler particles. In another aspect, a precipitated polymer solution produced by a phase inversion where the majority of the liquids can be mechanically removed.

A polymer composition comprises a thermoplastic polymer, a polymer additive selected from the group consisting of nucleating agents, clarifying agents, and combinations thereof, and a fluoropolymer. A molded article comprises at least one wall defining a cavity, the wall having an opening therein permitting access to the cavity. The wall comprises a polymer composition comprising a thermoplastic polymer, a polymer additive selected from the group consisting of nucleating agents, clarifying agents, and combinations thereof, and a fluoropolymer. A method for molding a polymer composition is also provided.

A battery separator includes a polyolefin microporous membrane having a width of 100 mm or more, and a porous layer laminated on at least one surface of the polyolefin microporous membrane. The polyolefin microporous membrane has a variation range of an F25 value in a width direction of 1 MPa or less, and the F25 value indicates a value obtained by dividing a load value measured at 25% elongation of a specimen with use of a tensile tester by a cross-sectional area of the specimen. The porous layer contains a fluorine-based resin and an inorganic particle.

A polymer composition comprises a thermoplastic polymer, a polymer additive selected from the group consisting of nucleating agents, clarifying agents, and combinations thereof, and a fluoropolymer. A molded article comprises at least one wall defining a cavity, the wall having an opening therein permitting access to the cavity. The wall comprises a polymer composition comprising a thermoplastic polymer, a polymer additive selected from the group consisting of nucleating agents, clarifying agents, and combinations thereof, and a fluoropolymer. A method for molding a polymer composition is also provided.

The instant disclosure relates to ethylene vinyl alcohol pellets including one or more fluorine-containing micro-particles having a particle size that is not greater than 20 m. The EVOH films formed from the EVOH pellets may have a Charpy impact strength of at least 2.45 KJ/m.sup.2 according to ISO 179-1 at 23 C. and an elongation at break of at least 17.8% according to ISO 527-2 at 23 C.

A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350 C. to 250 C. via a lowering temperature rate of 1 to 4 C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulos; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.

The present invention pertains to a fluoropolymer film comprising at least one fluoropolymer hybrid organic/inorganic composite [polymer (FH)], to a process for the manufacture of said fluoropolymer film and to uses of said fluoropolymer film in various applications, in particular in electrochemical applications.

The present invention relates to a processing aid of a non-fluorinated melt-processable polymer and a masterbatch for a processing aid, features the inclusion of a processing aid comprising a fluoropolymer forming clustered secondary particles each having a particle size of 2 m to 2 mm and being a combination of primary fluoropolymer particles each having a diameter of 0.02 m to 0.5 m, and may accelerate the elimination of melt fracture despite the omission of an interfacial agent and decrease extrusion load upon process to thereby enhance productability.