Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

The resin-coated metal sheet for containers includes a resin coating layer (A) having a multilayered structure mainly composed of a polyester resin on at least one surface thereof. The resin coating layer (A) includes a resin layer (a1). The resin layer (a1) adheres to the metal sheet, contains (i) a polyester resin, (ii) a phenolic resin, (iii) a metal alkoxide compound and/or a metal chelate compound, (iv) an epoxy resin, and (v) at least one selected from the group consisting of polyamine resins, polyamidoamine resins, and polyamide resins, and is mainly composed of the polyester resin. Preferably, a polyester film (a2) is disposed on the resin layer (a1).

This disclosure relates to thermosetting compositions suitable for use in making electronic materials such as circuit board substrates, as well as cured compositions, prepregs and laminates based on such thermosetting compositions. One aspect of the disclosure is a thermosetting composition comprising: an aromatic epoxy resin component; a poly(styrene-co-maleic anhydride) component; a maleimide-bearing oligomer component; the maleimide-bearing oligomer component having an average of at least 4 maleimides per molecule, on a number average, and a softening point of no more than 100 C.; a benzoxazine/maleimide component, that is a bis(benzoxazine) subcomponent and a bis(maleimide) subcomponent, and/or a reaction product thereof; an aromatic primary diamine component; microparticulate silica; an organic halogen-free fire retardant component; an effective amount of one or more catalysts.

The present invention provides a resin composition containing (A) one or more selected from the group consisting of a maleimide resin having one or more N-substituted maleimide groups and a derivative of the maleimide resin, and (B) a compound having a vinyl benzyl group, in which the component (B) contains one or more selected from the group consisting of (B1) a compound having 3 or more vinyl benzyl groups bonded to an oxygen atom and (B2) a compound having one or more vinyl benzyl groups bonded to a carbon atom, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package in which the resin composition is used.

The present invention provides a curable resin having excellent dielectric properties, a curable resin composition, and cured products thereof. The present invention specifically provides a curable resin which is represented by formula (1). In formula (1), A represents any of the following formulas (1-a) to (1-d). The plurality of X each independently represent any of the following formulas (1-e) to (1-g). The plurality of R.sub.1 each independently represent a residue obtained by removing one hydrogen atom from a C9 petroleum resin. The plurality of R.sub.2 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an amino group, or a hydroxy group. The plurality of s and t are each independently an integer of 0 to 3, and the total of s, which is the number of R.sub.1 moieties, and t, which is the number of R.sub.2 moieties, the moieties being bonded to the same aromatic ring, is an integer of 0 to 3. The average value of s s.sub.ave satisfies 0<s.sub.ave3, and the average value of t t.sub.ave satisfies 0t.sub.ave2. n is the average number of repetitions and satisfies 0.1n5.

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