Provided is a method for preparing a carbon nanotube/polymer composite material, including: coating a nano-silicon oxide film on the surface of a porous polymer by vacuum coating; depositing a metal catalyst nano-film on the nano-silicon oxide film by vacuum sputtering; growing a carbon nanotube array in situ on the surface of the porous polymer by plasma enhanced chemical vapor deposition to obtain a carbon nanotube/polymer porous material; and impregnating the carbon nanotube/polymer porous material with a polymer and curing to obtain the carbon nanotube/polymer composite material. By using a heat-resistant polymer having a high heat-resistant temperature and a PECVD technique, a carbon nanotube array directly grows in situ on the surface of a polymer at a low temperature, which thereby overcomes the defects of the composites previously prepared, in which carbon nanotubes are difficult to be homogeneously dispersed and the interfacial bonding force in the composites is weak.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): ##STR00001## wherein, R.sub.1 to R.sub.3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm.sup.−1 to 1630 cm.sup.−1 and a signal intensity “b” from 1620 cm.sup.−1 to 1560 cm.sup.−1, and 0<a/b≤1.20; and the quantitative .sup.1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d≤1.20.

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate. ##STR00001##

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

A spacer used in an electrical device that sends and receives radio waves comprises a foam that contains a resin composition containing a thermoplastic or thermosetting resin as a base resin. When the foam is not a bead foam, a ratio (B/A) of an average diameter B of central section cells relative to an average diameter A of surface layer cells is not less than 0.3 and less than 3.0. When the foam is a bead foam, a ratio (B′/A′) of an average diameter B′ of center cells relative to an average diameter A′ of outermost layer cells is not less than 0.3 and less than 3.0. Water absorption of the resin composition in a high-temperature and high-humidity environment is 2.2 mass % or less, and (εr).sup.1/2×tan δ (εr: relative permittivity, tan δ: a dielectric dissipation factor) is 0.0120 or less at 28 GHz.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

Disclosed herein are various cable gel seal arrangements and thermoplastic gels useful therein. The thermoplastic gels are prepared from a composition including a styrene triblock copolymer, a styrene diblock copolymer, an oil extender, and an additive selected from poly(2,6-dimethyl-1,4-phenylene oxide), a C9 resin, poly(alpha-methylstyrene), a coumarone-indene resin, and combinations thereof, wherein the additive has a T.sub.g from about 95° C. to about 200° C. The thermoplastic gels advantageously exhibit low compression set.

A laminate has an olefin-aromatic vinyl compound-aromatic polyene copolymer and a metal foil. The number average molecular copolymer weight is between 5000 and 100000; the aromatic vinyl compound monomer is aromatic vinyl compound having between 8 and 20 carbon atoms, and the aromatic vinyl compound monomer unit content is between 10 and 60 mass %; the aromatic polyene is selected having between 5 and 20 carbon atoms and vinyl and/or vinylene groups in the molecule, the content derived from the aromatic polyene unit is between 1.5 and 20 pieces per number average molecular weight; and the olefin is selected having between 2 and 20 carbon atoms, being ethylene alone, or having a mass ratio of α-olefin monomer components other than ethylene to an ethylene monomer component contained in the olefin, of 1/7 or less, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.