The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

A latex composition for dip forming, and more particularly, to a latex composition for dip forming includes carboxylic acid-modified nitrile-based copolymer latex; and a phenolic emulsifier, wherein the phenolic emulsifier is included in an amount of 0.08 parts by weight to 6 parts by weight (based on a solid content) based on 100 parts by weight of the carboxylic acid-modified nitrile-based copolymer latex. A method for preparing the latex composition and a formed article produced using the latex composition are also provided.

A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-separation part.

A fiber-reinforced resin pellet comprising a thermoplastic resin (A) containing crystalline polystyrene having a syndiotactic structure, and glass fibers (B) having a number-average fiber length of 1 mm or more and 7 mm or less; a mixed pellet obtained by blending a thermoplastic resin pellet with the fiber-reinforced resin pellet; and an injection-molded article obtained by injection molding the fiber-reinforced resin pellet or the mixed pellet.

The present invention discloses a multilayer composite rubber-plastic foam insulation material and a preparation method thereof. The composite rubber-plastic foam insulation material includes a two-layer structure; the two-layer structure includes an insulation layer and a first functional layer; the insulation layer and the first functional layer are both made of a rubber-plastic foam material; the first functional layer and the insulation layer are integrally molded by blending extrusion and vulcanization foaming, and the first functional layer and the insulation layer form an integral structure. The multilayer composite rubber-plastic foam insulation material provided by the present invention adopts a vulcanization foaming integral molding process, and not only ensures the thermal insulation property of the insulation layer, but also gives the functional layer corresponding functions by selecting different functional polymers, thereby satisfying a variety of personalized needs in engineering applications.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I):

##STR00001## wherein, R.sub.1 to R.sub.3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm.sup.−1 to 1630 cm.sup.−1 and a signal intensity “b” from 1620 cm.sup.−1 to 1560 cm.sup.−1, and 0<a/b≤1.20; and the quantitative .sup.1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d≤1.20.