C08K3/041

Z-CNT filled meltable adhesives for bonding of deicers

A method of making an adhesive for an ice protection assembly includes transferring Z-CNTs from a substrate carrier into the adhesive. De-bonding of the adhesive for ice protection assembly inspection or repair or repositioning at initial installation includes heating the Z-CNTs in the adhesive to soften the adhesive and allow for easy removal.

COMPOSITE MATERIAL, CARBON FIBER-REINFORCED MOLDED BODY, AND METHOD FOR PRODUCING COMPOSITE MATERIAL
20220411601 · 2022-12-29 · ·

A composite material includes a carbon fiber bundle including a plurality of continuous carbon fibers; and a structure, formed on each of the carbon fibers, including a plurality of carbon nanotubes and having a network structure in which the carbon nanotubes are in direct contact with each other and in which the carbon nanotubes directly adhere to surfaces of the carbon fibers. The carbon nanotubes have a bent shape including a bent portion, and a thickness of the structure is within a range of 50 nm to 200 nm.

Systems and methods for post-treatment of dry adhesive microstructures
11534926 · 2022-12-27 · ·

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

METHOD FOR CHEMICALLY ADHERING A DIENE RUBBER TO A PIEZOELECTRIC POLYMER

The present invention relates to a method for chemically adhering a diene rubber to a piezoelectric polymer, the method comprising the steps of: a) providing a piezoelectric polymer having at least one surface, b) providing a rubber component having at least one surface and comprising a sulfur cross-linkable rubber composition, c) introducing oxygen-containing functional groups on the at least one surface of the piezoelectric polymer, d) reacting the oxygen-containing functional groups with a compound comprising thiocyanate groups, and e) contacting the surface of the piezoelectric polymer obtained of step d) with the surface of the rubber component, and cross-linking.

METHOD FOR CHEMICALLY ADHERING A DIENE RUBBER TO A PIEZOELECTRIC POLYMER

The present invention relates to a method for chemically adhering a diene rubber to a piezoelectric polymer, the method comprising the steps of: a) providing a piezoelectric polymer having at least one surface, b) providing a rubber component having at least one surface and comprising a sulfur cross-linkable rubber composition, c) introducing oxygen-containing functional groups on the at least one surface of the piezoelectric polymer, d) reacting the oxygen-containing functional groups with a compound comprising thiocyanate groups, and e) contacting the surface of the piezoelectric polymer obtained of step d) with the surface of the rubber component, and cross-linking.

TYRE COMPRISING A PIEZOELECTRIC DEVICE
20220402312 · 2022-12-22 ·

The present invention relates to a vehicle tyre comprising a piezoelectric device, wherein the piezoelectric device comprises a layer of a piezoelectric polymer having first and second opposing sides, and a first and a second layer of conductive rubber provided adjacent to the first and second opposing sides of the layer of piezoelectric polymer.

TYRE COMPRISING A PIEZOELECTRIC DEVICE
20220402312 · 2022-12-22 ·

The present invention relates to a vehicle tyre comprising a piezoelectric device, wherein the piezoelectric device comprises a layer of a piezoelectric polymer having first and second opposing sides, and a first and a second layer of conductive rubber provided adjacent to the first and second opposing sides of the layer of piezoelectric polymer.

ELECTROPHOTOGRAPHIC BELT, ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS, METHOD OF PRODUCING ELECTROPHOTOGRAPHIC BELT, AND VARNISH
20220404750 · 2022-12-22 ·

Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

ELECTROPHOTOGRAPHIC BELT, ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS, METHOD OF PRODUCING ELECTROPHOTOGRAPHIC BELT, AND VARNISH
20220404750 · 2022-12-22 ·

Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

ELECTROPHOTOGRAPHIC BELT, ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS, FIXING DEVICE, AND VARNISH

Provided is an electrophotographic belt of an endless shape including a substrate, wherein the substrate contains a polyimide resin and carbon nanotubes, wherein a content of the carbon nanotubes in the substrate is 15 vol % or less with respect to a total volume of the polyimide resin, wherein the substrate has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction, and wherein the substrate has a thermal conductivity of 0.9 W/(m.Math.K) or more in a thickness direction thereof.