A bio-electrode composition contains (A) a silicone bonded to an ionic polymer and having a structure containing a T unit shown by the following general formula (T1): (R.sup.0SiO.sub.3/2) (T1), the structure excluding a cage-like structure. In the formula, R.sup.0 represents a linking group to the ionic polymer. The ionic polymer is a polymer containing a repeating unit having a structure selected from the group consisting of salts of ammonium, lithium, sodium, potassium, and silver formed with any of fluorosulfonic acid, fluorosulfonimide, and N-carbonyl-fluorosulfonamide. Thus, the present invention provides a bio-electrode composition capable of forming a living body contact layer for a bio-electrode which is excellent in electric conductivity, biocompatibility, stretchability, and adhesion, soft, light-weight, and manufacturable at low cost, and which prevents significant reduction in the electric conductivity even when wetted with water or dried.

Poroelastic materials, methods of making such materials, biosensors comprising such materials, and methods of making and using such biosensors. According to one aspect, a poroelastic material is formed by a process that includes depositing a prepolymer composition on a substrate, annealing the prepolymer composition in a pressurized steam environment at a temperature and for a duration sufficient to form a porous medium having a solid matrix formed of a polymer derived from the prepolymer composition, infiltrating the porous medium with a liquid that includes electrically conductive nanomaterials such that the electrically conductive nanomaterials are located within pores of the porous medium, and evaporating the liquid such that the electrically conductive nanomaterials remain in and/or connected through the pores of the porous medium.

A nanowire heating and insulating element that includes a first layer having overlapping nanowires dispersed therein and a second layer that is two conductive portions spaced apart on either side of the first layer. Electrical potential is applied to the two conductive portions such that electricity flows through the nanowires of the first layer to heat the heating element. In addition, the heating element may be applied to existing surfaces of a room having a multiple sensor pack therein which is in wireless communication with multiple devices, or Adaptors. One or more of the adaptors supply electrical potential for the heating element and is in wireless communication with a controller which is configured to monitor usage of the Adaptors and control the Adaptors as needed to respond to usage events or environmental conditions based at least in part on readings from the sensor pack.

An effect paint for automobiles, comprising water, a dispersant (A), cellulose nanofibers (B), and an effect pigment (C).

An object of the present invention is to provide an adhesive composition having excellent adhesiveness and crack resistance. The present invention relates to a conductive adhesive composition comprising (a) a (meth)acrylic acid ester monomer, (b) a tackifier, (c) bismaleimide, and (d) a radical initiator, wherein a homopolymer of the (meth)acrylic acid ester monomer (a) has a glass transition temperature (T.sub.g) of 50° C. or lower, and the tackifier (b) has a Hazen unit colour number of 300 or less.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

A composition of the present disclosure includes an aqueous dispersion of epoxy resin particles. The epoxy resin particles include at least two 1,2-epoxide groups. The composition further includes one or more anti-adhesive agents, one or more anti-microbial agents, or a combination of one or more anti-adhesive agents and one or more anti-microbial agents.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.