A method can include polymerizing a blend of materials where the materials include polymeric material and a degradable alloy material; and forming a degradable component from the polymerized blend of materials. Such a method can include exposing the degradable component to water where the degradable alloy material reacts with the water to at least in part degrade the component.

A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.

Provided herein are polysiloxane-based composite materials comprising a high weight percentage of elemental components (e.g., elemental boron, elemental copper, elemental bismuth, elemental lead) and low levels of carbon nanofibers. The elemental components may be present in the composite materials at levels greater than 25% by weight. Also provided herein are methods of forming the composite materials that have desirable flexibility and shielding properties. The invention provides a versatile composite material that is compliant and moldable, while still comprising high levels of the elemental shielding components. The materials are particularly useful for applications in which radiation shielding or neutron capture are desired.

The present disclosure provides a modified polymethylhydrosiloxane, a modified high-cis conjugated diene polymer, and a manufacturing method for the same, and a rubber composition and a tire using the same. The manufacturing method for the modified high-cis conjugated diene polymer comprises: performing a polymerization reaction to form a high-cis conjugated diene polymer; and making the high-cis conjugated diene polymer react with a first modifier, and then react with a condensation accelerator and a second modifier to generate a modified high-cis conjugated diene polymer; wherein the modified high-cis conjugated diene polymer has over 97% of cis-1,4 structure. The second modifier comprises a compound represented by the following formula (1). ##STR00001##

A conductive polymer composite includes: a thermoplastic polymer; a plurality of carbon nanotubes; and a plurality of metallic particulates in an amount ranging from about 0.5% to about 80% by weight relative to the total weight of the conductive polymer composite.

Compositions, devices, and methods for determining ionizing radiation are generally described.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.