A computational method for development of radiation shielding compositions, as described herein, can include selecting at least one polymer and at least one metal for each of a plurality of radiation shielding compositions, selecting a polymer:metal ratio for each composition, performing computational analysis to calculate an attenuation coefficient associated with a given radiation dose for each composition, identifying a best candidate composition for radiation shielding based on the calculated attenuation coefficients, and preparing a radiation shielding material including the at least one polymer, the at least one metal, and the polymer metal ratio associated with the best candidate composition.

Provided is a process for producing a surface-metalized polymer film, comprising: (a) feeding a continuous polymer film from a feeder into a graphene deposition chamber which accommodates a graphene dispersion comprising multiple graphene sheets and an optional conducive filler dispersed in a first liquid medium and an optional adhesive resin dissolved in this first liquid medium; (b) operating the graphene deposition chamber to deposit the graphene sheets and optional conductive filler to at least a primary surface of the polymer film for forming a graphene-coated polymer film; (c) moving the graphene-coated film into a metallization chamber which accommodates a plating solution for plating a layer of a desired metal onto the graphene-coated polymer film to obtain a surface-metalized polymer film; and (d) operating a winding roller to collect the surface-metalized polymer film. This film exhibits a high scratch resistance, strength, hardness, electrical conductivity, thermal conductivity, light reflectivity, gloss, etc.

Provided is a surface-metalized polymer article comprising a polymer component having a surface, a first layer of combined multiple graphene sheets and a conductive filler (e.g. metal nanowires or carbon nanofibers) coated on the polymer component surface, and a second layer of a plated metal deposited on the first layer, wherein the multiple graphene sheets contain single-layer or few-layer graphene, and wherein the multiple graphene sheets and conductive filler are bonded to the polymer component surface with or without an adhesive resin.

Provided is an apparatus for manufacturing a surface-metalized polymer article, the apparatus comprising: (a) a graphene deposition chamber that accommodates a graphene dispersion comprising multiple graphene sheets and an optional conducive filler dispersed in a first liquid medium and an optional adhesive resin dissolved in the first liquid medium, wherein the graphene deposition chamber is operated to deposit the graphene sheets and optional conductive filler to a surface of at least a polymer component for forming at least a graphene-coated polymer component; and (b) a metallization chamber that accommodates a plating solution for plating a layer of a desired metal on the at least a graphene-coated polymer component to obtain the surface-metalized polymer article.

Compositions, devices, and methods for determining ionizing radiation are generally described.

Provided is a surface-metalized polymer film comprising: (a) a polymer film having a thickness from 10 nm to 5 mm and two primary surfaces; (b) a graphene layer having a thickness from 0.34 nm to 50 m and comprising multiple graphene sheets and an optional conducive filler coated on or bonded to at least one of the two primary surfaces with or without using an adhesive resin; and (c) a metal layer comprising a plated metal deposited on the graphene layer; wherein the graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof. This film exhibits a high scratch resistance, strength, hardness, electrical conductivity, thermal conductivity, light reflectivity, gloss, etc.

Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Provided is a bismuth golf ball with improved carry distance and fracture strength by adding a nano bismuth reformed by using plasma or a nano bismuth alloy manufactured by using the nano bismuth to a resin composition as a base material as compared with a bismuth golf ball in the related art. Since the nano bismuth golf ball has a more densified internal structure due to a higher content of bismuth as compared with the bismuth golf ball, the resilient elasticity is improved, and thus, the carry distance is increased.

The present disclosure provides a modified polymethylhydrosiloxane, a modified high-cis conjugated diene polymer, and a manufacturing method for the same, and a rubber composition and a tire using the same. The manufacturing method for the modified high-cis conjugated diene polymer comprises: performing a polymerization reaction to form a high-cis conjugated diene polymer; and making the high-cis conjugated diene polymer react with a first modifier, and then react with a condensation accelerator and a second modifier to generate a modified high-cis conjugated diene polymer; wherein the modified high-cis conjugated diene polymer has over 97% of cis-1,4 structure. The second modifier comprises a compound represented by the following formula (1).

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The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.