Disclosed herein are method and design rules for making polyelemental systems with specific heterostructures, including tetra-phase nanopartides with as many as six junctions. In accordance with an embodiment, a method of making a tetra-phase polyelemental nanoparticle using tri-phase nanoparticle architectures can include selecting two or more triphase nanoparticle architectures, wherein the two or more tri-phase nanoparticle architectures are one or more striped tri-phase architectures, one or more pie-shaped tri-phase architectures, or combinations thereof; identifying from the selected two or more tri-phase nanoparticle architectures groups of metals for generating each of the two or more tri-phase nanoparticle architectures; contacting a tip coated with an ink to a substrate to form a nanoreactor, the ink comprising block copolymer and the metals from the groups of metals identified for generating each of the two or more tri-phase nanoparticle architectures; and annealing the nanoreactors under conditions sufficient to synthesize a tetra-phase polyelemental nanoparticle.

An oxygen-absorbing resin composition containing an ethylene terephthalate type polyester resin and an organic oxygen absorber and, further, containing cobalt in an amount of 5 to 50 ppm and titanium in an amount of 1 to 15 ppm calculated as elements.

Provided is a conductive paste which makes it possible to form a conductive layer having excellent conductivity even when spherical copper powder having a small particle diameter is used. Disclosed is a conductive paste containing a conductive filler and a binder resin. In this conductive paste, when a first coating film is prepared by coating a first paste containing 100 parts by weight of the binder resin and 20 parts by weight of the conductive filler on a first substrate at a coating amount of 100 g/m.sup.2 and drying and curing the binder resin, the first coating film has a light transmittance of 20% or more, and when a second coating film is prepared by coating a second paste containing the binder resin but not containing the conductive filler on a second substrate at a coating amount equivalent to a dry solid content of 55 g/m.sup.2 and drying and curing the binder resin, a film thickness t μm of the second coating film and a shrinkage ratio α % obtained by the following formula (1) satisfy a relationship of the following formula (2): α=(1−(arc length of a surface of the second coating film after drying and curing)/(arc length of a second substrate after drying and curing))×100 Formula (1) and α≥(5t+50)×10.sup.−3 Formula (2).

Foam compositions, cushions, and related methods of manufacture are disclosed. The foam composition or cushion includes a polymer that includes about 2% to about 10% polyol comprising multiple hydroxyl groups, about 1% to about 25% isocyanate and about 75% to about 95% filler suspended in the polymer.

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.

An object is to provide a magnetic compound excellent in high frequency properties and excellent in mechanical strength, and its related items, using the polyarylene sulfide resin, and to provide a technique regarding the magnetic compound having a metal magnetic powder and a polyarylene sulfide resin, and satisfying both mechanical strength and high frequency properties.

Disclosed are composite cables suitable for use in conjunction with wellbore tools. One cable may include a polymer composite that includes dopants dispersed in a polymer matrix and continuous fibers extending along an axial length of the cable through the polymer matrix, wherein the cable is characterized by at least one of the following: (1) at least a portion of the cable having a density greater than about 2 g/cm.sup.3, wherein at least some of the dopants have a density of about 6 g/cm.sup.3 or greater, (2) at least a portion of the cable having a density less than about 2 g/cm.sup.3, wherein at least some of the dopants have a density of about 0.9 g/cm.sup.3 or less, (3) at least some of the dopants are ferromagnetic, or (4) at least some of the dopants are hydrogen getters.

A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a poly(amino acid) and or a salt thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.

A method of printing a three dimensional article (201) can include forming a bottom layer of the three dimensional article (201) by spraying a dry build material powder (210) onto a build platform (230) while heating the dry build material powder (210). The dry build material powder (210) can include metal or ceramic particles mixed with a polymeric binder having a softening point temperature. The dry build material powder (210) can be heated to a temperature above the softening point temperature such that the dry build material powder (210) adheres to the build platform (230). Subsequent layers can be formed by spraying dry build material powder (210) onto a lower layer while heating the dry build material powder (210) such that the dry build material powder (210) adheres to the lower layer.