A printable antimicrobial medium is disclosed, including a substrate layer having a first surface which may include a first area, a second surface opposite the first surface which may include a second area. The printable antimicrobial medium also includes a first adhesive deposited on the first area, a liner layer releasably secured to the substrate layer by the first adhesive, and a first antimicrobial dry marking material deposited on at least a portion of the second area of the substrate layer. The printable antimicrobial medium may include a first score line arranged to separate one or more layers of the printable antimicrobial medium into a first portion and a second portion, and an antimicrobial dry marking material may include copper oxide deposited on at least a portion of the second area of the substrate layer.

A composite conductive polymer, a preparation method thereof and application thereof are disclosed, wherein a mixed solution A is used in the preparation process of the composite conductive polymer, which comprises the following two components: (i) a strong oxidant selected from at least one of permanganate, persulfate, dichromate and perchlorate; (ii) an oxidizing agent containing a metal ion capable of being reduced to elementary substance. The preparation process is simple and easy to operate, with low cost and favorable environmental protection and the obtained composite conductive polymer containing metal in elementary form, has good film-forming property and the film thereof can completely cover the surface of the insulating substrate, with excellent electrical conductivity, which therefore can be widely used in electroplating materials and semiconductor materials and other fields.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

A manufacturing method described in the present invention provides antimicrobial copper-containing polyurethane foams by embedding microparticles of metallic copper (Cu), cuprous oxide (Cu.sub.2O), cupric oxide (CuO), or cuprous iodide (CuI), or combinations thereof, into polyurethane foams, wherein said microparticles are homogenously distributed throughout the formed polymeric matrix of said foam. The method combines these copper-containing microparticles, or polyurethane liquid additive containing these particles, mixed in polyol with isocyanate.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Methods of protecting a propeller include applying an inner polymer layer onto a propeller. The inner polymer layer is impregnated with a biologically active chemical substance that inhibits biofouling-induced chemical, biological, and bio-proliferative damage and that does not chemically or galvanically interact with a material of the propeller. An outer polymer layer is applied onto the inner polymer layer, the outer polymer layer being impregnated with a biologically active chemical substance that inhibits biofouling-induced chemical, biological, and bio-proliferative damage and that repels biofouling organisms to prevent invasion of the inner polymer layer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

The invention relates to a hull of a vessel having characteristic surface properties, allowing an increase in surface runoff while benefiting from an inherent anti-fouling property and an original aesthetic appearance. Furthermore, the invention allows the incorporation of said outer composite envelope into the structure of the hull, thereby preventing delamination problems and inherently providing a vessel hull with the above-mentioned properties.

After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.3 to 20 μm, at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin, a chlorine compound, and a glycol solvent, such as ethylene glycol, the total amount of the fine copper particles and the coarse copper particles being 50 to 90% by weight, and the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.

Composition for making magnetic coverings comprising at least one elastomer, at least one magnetic filler, at least one compatibilizer, wherein the at least one magnetic filler is present in the composition in an amount comprised between 90% and 300% by weight, preferably between 100% and 250% by weight based on the weight of the least one elastomer.