Patent classifications
C08K2003/0862
Methods for Microelectronics Fabrication and Packaging Using a Magnetic Polymer
A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.
Adhesive film
One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.
Method of manufacturing a functionally graded article
Disclosed herein are methods for manufacturing a functionally graded polymer material. The methods comprise preparing a melted polymer mixture comprising a thermoplastic polymer and a magnetic filler dispersed in the thermoplastic polymer, molding the melted polymer mixture and applying a magnetic field to a portion of the melted polymer mixture to form a functionally graded polymer material. The resulting functionally graded polymer material has a magnetic filler gradient formed through a thickness of the material.
BARRIER LAYER AND USE THEREOF IN COATING SYSTEMS ON PLASTIC SUBSTRATES
A coating material for producing a barrier layer on a plastic substrate includes an isocyanate-containing hardener component and a hydroxy-functional binder component. The hydroxy-functional binder component includes an aqueous polymer dispersion which includes a polyphenylene ether or a copolymer of fluorinated ethylene and a vinyl ether, glass hollow bodies, and at least one of an inorganic filler and an inorganic pigment.
ADHESIVE FILM, COMPOSITE FILM, ALL-SOLID-STATE BATTERY AND METHOD FOR PRODUCING COMPOSITE FILM
A composite film 10 according to the present invention is provided with: a resin film 1 which is formed of a cured product of a photocurable adhesive composition; and solid particles 3 which are affixed, in the form of a single layer, to the resin film 1, while having edges thereof exposed from one and the other main surfaces of the resin film 1. The resin film 1 is formed by irradiating an adhesive layer 1a in a semi-cured state with light 13, said adhesive layer 1a being formed of the adhesive composition.
Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×10.sup.3 Pa.Math.s to 5×10.sup.6 Pa.Math.s.
Piezoelectric capacitor
A piezoelectric capacitor includes A) a composite article that has 1) a dry piezoelectric layer (dry PL); 2) a first dry electrode comprising a dry electrically-conductive layer arranged contiguously with a first opposing surface of the dry PL; and 3) a second dry electrode arranged contiguously with a second opposing surface of the dry PL. The dry electrically-conductive layer has essentially (a) an electrically-conductive material; and (b) particles having a Young's modulus that is different from the Young's modulus of the (a) electrically-conductive material by at least 10%. The capacitor also has B) electrical communication means attached to both electrodes for electrical communication of the composite article with an external electrical circuit.
Conductive paste and ceramic electronic component
A conductive paste obtained by adding an organic solvent B to a vehicle containing a Ni powder, a binder resin component, and an organic solvent A. The Ni powder has an average primary particle size of 30 to 400 nm. The binder resin component is cellulose acetate butyrate. Organic solvent A is a solvent having a Δ δ value of 11.5 or less with the cellulose acetate butyrate. Organic solvent B is a solvent having a Δ δ value from 11.5 to 25.0 with the cellulose acetate butyrate. A ratio of the organic solvent B relative to a total of the organic solvent A and the organic solvent B is 5.0 to 40.0 wt %.
LATEX FORMULATION AND X-RAY DETECTABLE GLOVE PREPARED THEREOF
A glove that is X-ray detectable prepared from a latex formulation comprises a base polymer, an accelerator, a vulcanizing agent, a surfactant, a pH adjuster, an antifoaming agent and a thickener characterized in that the latex formulation further includes radiocontrast filler, wherein the radiocontrast filler comprises a radiocontrast agent, a surfactant, a thickener and a solvent, wherein the radiocontrast filler is used in an amount of at least 10 phr of the latex formulation and wherein the radiocontrast filler has total solid content of 45%.
Thermal Spray Plastic Coating for Edge Sealing and Fillet Sealing
Tunable thermoplastic polymer sealants and tunable conductive thermoplastic polymer sealants, and edge seals and fillet seals produced from such sealants; and substrates, components and objects comprising the tunable edge seals and fillet seals, and methods for making and applying such edge seals and fillet seals are disclosed.