A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

Provided is a protection film including a plurality of layers, including a first carrier layer having a plurality of electrically conductive fibers; a metal layer; and a second carrier layer having a plurality of electrically conductive fibers. Each of the first and second carrier layers has a void volume at least partially filled with a hardenable composition. Also provided is a protection film including a first metal layer, a carrier layer, and a second metal layer, in which the carrier layer is at least partially filled with a hardenable composition. These films can provide lightning strike protection with suitable tensile, rigidity and tack properties for automatic tape layup and automatic fiber placement applications.

The present disclosure relates to an acrylic pressure sensitive adhesive tape including a moisture barrier layer in a release layer, and to an acrylic pressure sensitive adhesive tape, which can enhance adhesion by the moisture barrier layer preventing reduction of adhesion of an acrylic adhesive layer caused by moisture.

A conductive ink composition is disclosed comprising conductive solids and a medium, wherein the conductive solids comprise glass flakes coated with an electrically conductive coating. Optionally, the electrically conductive coating may comprise a conductor selected from the group comprising silver, nickel, gold, metal nanoparticles, indium tin oxide, fluorine doped tin oxide. The conductive ink composition may comprise a percentage by weight of glass flakes coated with an electrically conductive coating less than or equal to 50%. Also disclosed is a method of manufacturing the conductive ink composition, a printed article, and a method of manufacturing the printed article.

The present invention provides a self-healing platform unit for pressure and analyte sensing, and a method for fabrication thereof, the platform unit comprising a self-healing substrate comprising a dynamically crosslinked polymer comprising polymeric chains and crosslinking bridges; at least one self-healing electrode comprising a non-crosslinked polymer and metal microparticles dispersed therein, wherein the at least one self-healing electrode is deposited on the substrate; and at least one sensor comprising metal nanoparticles capped with an organic coating, wherein the at least one sensor is deposited on the substrate and is in electric contact with the at least one self-healing electrode.

A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.

Provided is a thermoplastic resin composition, including (a) 100 parts by weight of a thermoplastic resin including 80-100% by weight of a base resin and 0-20% by weight of a reinforcing resin; (b) 2-60 parts by weight of linear carbon fibers having an average diameter of 1-15 μm; (c) 1-5 parts by weight of carbon nanofibrils having a BET specific surface area of 200-400 m.sup.2/g; (d) 1-15 parts by weight of carbon nanoplates; and (e) 1-25 parts by weight of metal powder, a method of preparing the thermoplastic resin composition, and an injection-molded article manufactured using the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, e.g., impact strength, and also excellent conductivity, heat resistance, and electromagnetic wave shielding capacity, particularly high shielding efficiency against high-frequency electromagnetic waves, and thus can be used as automobile, electric, and electronic parts, and as a substitute for aluminum alloys and magnesium alloys.

A composition and method for spray-applying a two-part, self-setting composition containing a dopant that provides a hazard shielding component and is particularly adapted for delivering the components of the composition at a temperature that promotes their spray application as well as a self-setting reaction. The method includes selecting a self-setting compound that is adapted for curing in place once applied, the self-setting compound including at least one dopant material; and applying the compound to a hazard to be encapsulated such as a radiological, lead, asbestos, or PCB. Alternately, a self-curing compound includes a multi-part compound which, upon a mixing of the parts, chemically reacts and cures, and at least one dopant material dispersed into at least one of the parts, wherein the dopant material is selected for providing radiation shielding upon application of the compound.

An electronic device according to an example embodiment of the present disclosure includes a first substrate, a conductive layer formed on the first substrate, a first pad electrode that is electrically connected to and extends from the conductive layer, a second substrate electrically connected to the first pad electrode, and an adhesive member disposed between the first pad electrode and the second substrate. The adhesive member includes a conductive fiber sheet. The electronic device according to various embodiments of the present disclosure uses an adhesive member which includes a plurality of conductive fiber sheets and an adhesive layer having an adhesive and conductive particles. Therefore, it is possible to easily attach electronic parts at a low temperature and a low pressure and minimize damages of the pad electrode and the substrate of the electronic parts which may be caused during the adhering process.

A cable can be used to facilitate electrical connections between electrical components. The cable can include a plurality of cable strands forming a void space. An adhesive paste can be applied within the void space. The adhesive paste can include a plurality of metallic nanoparticles. The metallic nanoparticles can fuse with each other and with the plurality of cable strands when energy is applied the connector and the cable. The metallic nanoparticles can include a surfactant, which can be displaced as pressure is applied. Heat can be applied to the adhesive paste to fuse the metallic nanoparticles.