Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

An elastomeric composition is disclosed. The elastomeric composition includes, per 100 parts by weight of rubber (phr): 0 to about 50 phr of a polybutadiene having a cis-1,4 linkage content of at least 95%; about 50 to 100 phr of natural rubber or polyisoprene; a curative agent; an antioxidant; about 10 to about 80 phr carbon black; optionally about 30 to about 70 phr silica; about 1 to about 20 phr hydrocarbon resin; and about 5 to about 30 phr of a polymer selected from the group consisting of ethylene-propylene-diene terpolymer, butyl rubber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methyl-styrene-co-isoprene) terpolymer. The polymer based on ethylene-propylene-diene terpolymer, butyl rubber, oly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer may be functionalized.

An elastomeric composition is disclosed. The elastomeric composition includes, per 100 parts by weight of rubber (phr): 0 to about 50 phr of a polybutadiene having a cis-1,4 linkage content of at least 95%; about 50 to 100 phr of natural rubber or polyisoprene; a curative agent; an antioxidant; about 10 to about 80 phr carbon black; optionally about 30 to about 70 phr silica; about 1 to about 20 phr hydrocarbon resin; and about 5 to about 30 phr of a polymer selected from the group consisting of ethylene-propylene-diene terpolymer, butyl rubber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methyl-styrene-co-isoprene) terpolymer. The polymer based on ethylene-propylene-diene terpolymer, butyl rubber, oly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer may be functionalized.

An elastomeric composition is disclosed. The elastomeric composition includes, per 100 parts by weight of rubber (phr): about 5 to about 40 phr of styrene/butadiene copolymer; about 60 to about 100 phr of natural mbber or polyisoprene; a curative agent; an antioxidant; about 1 to about 20 phr carbon black; about 5 to about 40 phr plasticizing agent; about 40 to about 80 phr silica; about 1 to about 20 phr silane coupling agent and about 5 to about 30 phr of a polymer selected from the group consisting of ethyl-ene-propylene-diene terpolymer, butyl mbber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer. The polymer based on ethylene-propylene-diene terpolymer, butyl mbber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer may be functionalized.

An elastomeric composition is disclosed. The elastomeric composition includes, per 100 parts by weight of rubber (phr): about 5 to about 40 phr of styrene/butadiene copolymer; about 60 to about 100 phr of natural mbber or polyisoprene; a curative agent; an antioxidant; about 1 to about 20 phr carbon black; about 5 to about 40 phr plasticizing agent; about 40 to about 80 phr silica; about 1 to about 20 phr silane coupling agent and about 5 to about 30 phr of a polymer selected from the group consisting of ethyl-ene-propylene-diene terpolymer, butyl mbber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer. The polymer based on ethylene-propylene-diene terpolymer, butyl mbber, poly(isobutylene-co-para-methylstyrene) and poly(isobutylene-co-para-methylstyrene-co-isoprene) terpolymer may be functionalized.

Provided are a rubber composition which provides a self-healing rubber with improved strength and wet grip performance, and a pneumatic tire including the rubber composition. The present disclosure relates to a rubber composition containing a rubber component having a functional group containing a cationic functional group and/or an anionic functional group, a filler capable of generating a charge paired with the functional group, and sulfur.

Provided are a rubber composition which provides a self-healing rubber with improved strength and wet grip performance, and a pneumatic tire including the rubber composition. The present disclosure relates to a rubber composition containing a rubber component having a functional group containing a cationic functional group and/or an anionic functional group, a filler capable of generating a charge paired with the functional group, and sulfur.

A tire having excellent wet grip performance and low rolling resistance is provided. This tire is a tire obtained by using a rubber composition that includes a rubber component containing a rubber having an isoprene structure and an aminoalkoxysilane-modified styrene-butadiene rubber having an amount of bonded styrene of 15% or less; a filler containing a silica having a nitrogen adsorption specific surface area (BET method) of 130 m.sup.2/g or more and less than 330 m.sup.2/g, the amount of the filler being 40 to 125 parts by mass with respect to 100 parts by mass of the rubber component; and a hydrogenated resin having a softening point of higher than 110° C. and having a weight average molecular weight as converted to polystyrene of 200 to 1200 g/mol, the amount of the hydrogenated resin being 5 to 50 parts by mass per 100 parts by mass of the rubber component.