Provided are a rubber composition having excellent overall performance in terms of fuel economy and bleed resistance as well as good LCA performance (e.g., reduction of CO.sub.2 emissions), and a tire including the composition. A rubber composition containing a plant oil satisfying the conditions (1)-(4): (1) it is liquid at 23° C.; (2) it has a GPC weight-average molecular weight of more than 800; (3) when it is 3-fold diluted with THF, it satisfies the following relationship with respect to the absorbances at 450 nm and 600 nm measured with a spectrophotometer: Absorbance at 450 nm−Absorbance at 600 nm 0.05; and (4) it satisfies the following relationship with respect to the weights before and after passing 100 g of the plant oil at 23-30° C. through 20 mesh plain weave wire cloth: (Weight after passing through plain weave wire cloth)/(Weight before passing through plain weave wire cloth)×100≥99.0.

Provided are a rubber composition having excellent overall performance in terms of fuel economy and bleed resistance as well as good LCA performance (e.g., reduction of CO.sub.2 emissions), and a tire including the composition. A rubber composition containing a plant oil satisfying the conditions (1)-(4): (1) it is liquid at 23° C.; (2) it has a GPC weight-average molecular weight of more than 800; (3) when it is 3-fold diluted with THF, it satisfies the following relationship with respect to the absorbances at 450 nm and 600 nm measured with a spectrophotometer: Absorbance at 450 nm−Absorbance at 600 nm 0.05; and (4) it satisfies the following relationship with respect to the weights before and after passing 100 g of the plant oil at 23-30° C. through 20 mesh plain weave wire cloth: (Weight after passing through plain weave wire cloth)/(Weight before passing through plain weave wire cloth)×100≥99.0.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula

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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.

Provided is a flame-retardant resin composition containing a thermoplastic resin and a polysaccharide, wherein the polysaccharide includes an acidic polysaccharide composed of one or more selected from the group consisting of a polysaccharide having an acidic functional group, a derivative of the polysaccharide having an acidic functional group in which a site other than the acidic functional group is modified, and a salt thereof; and a total number of the acidic functional group and the salt thereof per monosaccharide unit in the acidic polysaccharide is in the range of 0.2 to 1.5.

Provided is a flame-retardant resin composition containing a thermoplastic resin and a polysaccharide, wherein the polysaccharide includes an acidic polysaccharide composed of one or more selected from the group consisting of a polysaccharide having an acidic functional group, a derivative of the polysaccharide having an acidic functional group in which a site other than the acidic functional group is modified, and a salt thereof; and a total number of the acidic functional group and the salt thereof per monosaccharide unit in the acidic polysaccharide is in the range of 0.2 to 1.5.

Magnet wire improved partial discharge performance may include a conductor, a first layer of polymeric enamel insulation formed around the conductor, and a second layer of polymeric enamel insulation formed around the first layer. The second layer may be a semi-conductive layer that includes a base polymeric material and filler particles dispersed within the base polymeric material. Additionally, at least sixty percent by weight of the filler particles may be positioned in an outer half of a thickness of the second layer.

Magnet wire improved partial discharge performance may include a conductor, a first layer of polymeric enamel insulation formed around the conductor, and a second layer of polymeric enamel insulation formed around the first layer. The second layer may be a semi-conductive layer that includes a base polymeric material and filler particles dispersed within the base polymeric material. Additionally, at least sixty percent by weight of the filler particles may be positioned in an outer half of a thickness of the second layer.