A method for preparing a compact of resin compound comprising the following steps (a) to (c): (a) a preparation step of mounting a sheet-shaped or block-shaped compact of resin compound including a resin composition, which contains a filler having magnetic anisotropy and is solidified by curing or by being advanced to a B-stage, on a transportation unit which is movable in the horizontal direction, and covering at least a top surface of the compact of resin compound with a cover material; (b) a step of applying a magnetic field to the compact of resin compound obtained in the step (a) with a bulk superconductor magnet having a central magnetic flux density of 1 T or more; and (c) a step of moving the compact of resin compound in the horizontal direction and scanning it while applying vibrations to the compact of resin compound mounted on a region of a central part of the bulk superconductor magnet under application of a magnetic field.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and an inorganic filler. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The present disclosure also provides a two-part composition, in which the polymeric material is included in the first part and the second part includes at least one amine. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

An article incorporates an enhanced dielectric breakdown strength and enhanced energy storage density composite material comprising a polymer matrix and hybrid filler particles comprising graphene oxide (GO) and a thermally conductive ceramic material having a thermal conductivity of at least 2 W/(m#K). The hybrid filler particles are distributed within the polymer matrix in a weight percentage less than about 15 weight percent.

An article incorporates an enhanced dielectric breakdown strength and enhanced energy storage density composite material comprising a polymer matrix and hybrid filler particles comprising graphene oxide (GO) and a thermally conductive ceramic material having a thermal conductivity of at least 2 W/(m#K). The hybrid filler particles are distributed within the polymer matrix in a weight percentage less than about 15 weight percent.

An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.

One aspect of the present invention provides a boron nitride powder that contains aggregated particles formed through aggregation of primary particles of boron nitride. The cumulative pore volume of the boron nitride powder within a fine pore radius of 0.02-1.2 μm as measured by a mercury porosimeter is 0.65 mL/g or less.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of particles of a metal compound having an average particle diameter (D.sub.50) of about 1 μm to about 6 μm.

Provided is a boron nitride powder having excellent adhesion to a resin. The boron nitride powder has a hexagonal structure, has a carboxyl group present on a surface of the boron nitride powder, and has a molar ratio of carboxyl group to nitrogen atom of 0.001 or more on a surface of the boron nitride powder.

Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.