A composite material includes a carbon fiber bundle including a plurality of continuous carbon fibers; and a structure, formed on each of the carbon fibers, including a plurality of carbon nanotubes and having a network structure in which the carbon nanotubes are in direct contact with each other and in which the carbon nanotubes directly adhere to surfaces of the carbon fibers. The carbon nanotubes have a bent shape including a bent portion, and a thickness of the structure is within a range of 50 nm to 200 nm.

An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.

An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.

An epoxy resin mixture which contains an epoxy resin represented by Formula (1) below and an epoxy resin represented by Formula (2) below at a weight ratio of 1:5 to 1:0.2. (In Formula (1), plural R1's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represent a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.) (In Formula (2), plural R2's and R3's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

##STR00001##

An epoxy resin mixture which contains an epoxy resin represented by Formula (1) below and an epoxy resin represented by Formula (2) below at a weight ratio of 1:5 to 1:0.2. (In Formula (1), plural R1's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represent a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.) (In Formula (2), plural R2's and R3's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

##STR00001##

The present disclosure relates to a method of preparing a monomolecular nano-thin film, including: coating, on a substrate, a dispersion solution containing a compound represented by the following Chemical Formula 1; and performing annealing to the coated substrate: ##STR00001## in the above Chemical Formula 1, X and Y are each independently nitrogen, carbon, sulfur, or oxygen, R.sub.1 and R.sub.2 are each independently hydrogen, oxygen, a hydroxy group (—OH), or a linear or branched C.sub.1 to C.sub.10 alkyl group.

Disclosed is a method of coating a high temperature fiber including depositing a base material on the high temperature fiber using atomic layer deposition, depositing an intermediate material precursor on the base material using molecular layer deposition, depositing a top material on the intermediate material precursor or the intermediate layer using atomic layer deposition, and heat treating the intermediate precursor. The intermediate material in the final coating includes a structural defect, has lower density than the top material or a combination thereof. Also disclosed are the coated high temperature fiber and a composite including the high temperature fiber.

Disclosed is a method of coating a high temperature fiber including depositing a base material on the high temperature fiber using atomic layer deposition, depositing an intermediate material precursor on the base material using molecular layer deposition, depositing a top material on the intermediate material precursor or the intermediate layer using atomic layer deposition, and heat treating the intermediate precursor. The intermediate material in the final coating includes a structural defect, has lower density than the top material or a combination thereof. Also disclosed are the coated high temperature fiber and a composite including the high temperature fiber.

The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.

The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.