A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component present therein. Printed parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles and a polymer material comprising at least one thermoplastic polymer and at least one thermally curable polymer precursor. At a sufficient temperature, the at least one thermally curable polymer precursor may undergo a reaction, optionally also undergoing a reaction with the piezoelectric particles, and form an at least partially cured printed part. The piezoelectric particles may be mixed with the polymer material and remain substantially non-agglomerated when combined with the polymer material. The compositions may define a form factor such as a composite filament, a composite pellet, or an extrudable composite paste, which may be utilized in forming printed part by extrusion, layer-by-layer deposition, and thermal curing.

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

The invention relates to fluoropolymer composites having a fluoropolymer matrix containing a functionalized fluoropolymer composition, and reinforced with fibers. The fibers can be chopped fibers, long fibers, or a mixture thereof, and the fluoropolymer matrix preferably is based on polyvinylidene fluoride. Any type of fibers, sized or unsized may be used with the functionalized fluoropolymer matrix composition to form the fluoropolymer composite.

The invention relates to fluoropolymer composites having a fluoropolymer matrix containing a functionalized fluoropolymer composition, and reinforced with fibers. The fibers can be chopped fibers, long fibers, or a mixture thereof, and the fluoropolymer matrix preferably is based on polyvinylidene fluoride. Any type of fibers, sized or unsized may be used with the functionalized fluoropolymer matrix composition to form the fluoropolymer composite.