A resin composition contains: a resin including one or more among a norbornene-based polymer, a monocyclic cycloolefin-based polymer, a cyclic conjugated diene-based polymer, a vinyl alicyclic hydrocarbon polymer, and hydrogenated products thereof; and a conductive fibrous filler having an aspect ratio of not less than 5 and not more than 500.

Thermoplastic compositions include from about 40 wt % to about 90 wt % of a crystalline polymer, from about 5 wt % to about 50 wt % basalt fibers, and from about 1 wt % to about 20 wt % of an impact modifier. In some aspects the crystalline polymer includes polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), copolymers thereof, or a combination thereof. The thermoplastic compositions are suitable for use in nano molding technology (NMT) applications, and in particular for consumer electronics applications.

Thermoplastic compositions include from about 40 wt % to about 90 wt % of a crystalline polymer, from about 5 wt % to about 50 wt % basalt fibers, and from about 1 wt % to about 20 wt % of an impact modifier. In some aspects the crystalline polymer includes polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), copolymers thereof, or a combination thereof. The thermoplastic compositions are suitable for use in nano molding technology (NMT) applications, and in particular for consumer electronics applications.

A camera module containing a molded part (e.g., generally planar base, lens barrel mounted on the base, etc.) that is formed from a polymer composition is provided. The polymer composition includes a liquid crystalline polymer and inorganic particles that have a hardness value of about 2.5 or more based on the Mohs hardness scale.

A camera module containing a molded part (e.g., generally planar base, lens barrel mounted on the base, etc.) that is formed from a polymer composition is provided. The polymer composition includes a liquid crystalline polymer and inorganic particles that have a hardness value of about 2.5 or more based on the Mohs hardness scale.

A plateable polymer composition is provided. The polymer composition comprises 100 parts by weight of a polymer matrix that includes a thermotropic liquid crystalline polymer, from about 10 parts to about 80 parts by weight of silicate fibers, and a noble metal catalyst.

A plateable polymer composition is provided. The polymer composition comprises 100 parts by weight of a polymer matrix that includes a thermotropic liquid crystalline polymer, from about 10 parts to about 80 parts by weight of silicate fibers, and a noble metal catalyst.

A plateable polymer composition is provided. The polymer composition comprises 100 parts by weight of a polymer matrix that includes a thermotropic liquid crystalline polymer, from about 10 parts to about 80 parts by weight of silicate fibers, and a noble metal catalyst.

An antenna module is provided. The antenna module comprises a dielectric on which is disposed one or more antenna elements configured to transmit and/or receive a radiofrequency signal; a communication circuit for processing the radiofrequency signal; an interconnect member that is electrically connected with the communication circuit and the antenna elements, wherein the interconnect member optionally contains a substrate on which a metal coating is disposed; and optionally, a shield member covering the communication circuit that contains a substrate on which a metal coating is disposed. The dielectric, the substrate of the interconnect member, and/or the substrate of the shield member contain a polymer composition comprising silicate fibers distributed within a polymer matrix that includes a thermotropic liquid crystalline polymer.

An antenna module is provided. The antenna module comprises a dielectric on which is disposed one or more antenna elements configured to transmit and/or receive a radiofrequency signal; a communication circuit for processing the radiofrequency signal; an interconnect member that is electrically connected with the communication circuit and the antenna elements, wherein the interconnect member optionally contains a substrate on which a metal coating is disposed; and optionally, a shield member covering the communication circuit that contains a substrate on which a metal coating is disposed. The dielectric, the substrate of the interconnect member, and/or the substrate of the shield member contain a polymer composition comprising silicate fibers distributed within a polymer matrix that includes a thermotropic liquid crystalline polymer.