The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

A waterproof component may be an insert molded body formed from a thermoplastic resin composition and a metal component. The thermoplastic resin composition may contain a thermoplastic resin (A), an inorganic reinforcement (B), and a polyolefin (C1) or a long-chain fatty acid-based compound (C2). The content of the inorganic reinforcement (B) may be in a range of from 8 to 130 parts by mass, and the content of the polyolefin (C1) or the long-chain fatty acid-based compound (C2) may be in a range of from 1.0 to 40 parts by mass, based on 100 parts by mass of the thermoplastic resin (A). An electronic device may be provided with the same.

A waterproof component may be an insert molded body formed from a thermoplastic resin composition and a metal component. The thermoplastic resin composition may contain a thermoplastic resin (A), an inorganic reinforcement (B), and a polyolefin (C1) or a long-chain fatty acid-based compound (C2). The content of the inorganic reinforcement (B) may be in a range of from 8 to 130 parts by mass, and the content of the polyolefin (C1) or the long-chain fatty acid-based compound (C2) may be in a range of from 1.0 to 40 parts by mass, based on 100 parts by mass of the thermoplastic resin (A). An electronic device may be provided with the same.

A novel silicon material is provided.

An MSix-containing silicon material contains MSix (M is at least one element selected from the group 3 to 9 elements. 1/3≦x≦3) in a silicon matrix.

A novel silicon material is provided.

An MSix-containing silicon material contains MSix (M is at least one element selected from the group 3 to 9 elements. 1/3≦x≦3) in a silicon matrix.

An aqueous dispersion containing (meth)acrylate polymer particles and substituted silsesquioxane-based particles dispersed in an aqueous carrier, wherein: (a) the substituted silsesquioxane-based particles have an volume-average size of 5 nanometers or more and at the same time less than 500 nanometers as determined by dynamic light scattering; and (b) the substituted silsesquioxane-based particles are substituted only with one or more than one moiety selected from a group consisting of alkyl, aryl, hydroxyl, trace amounts of alkoxy and combinations thereof and contain 50 mole-percent or less hydroxyl substitution in the form silanol functionalities relative to moles of substituted silsesquioxane-based particle as determined by infrared spectroscopy.

An aqueous dispersion containing (meth)acrylate polymer particles and substituted silsesquioxane-based particles dispersed in an aqueous carrier, wherein: (a) the substituted silsesquioxane-based particles have an volume-average size of 5 nanometers or more and at the same time less than 500 nanometers as determined by dynamic light scattering; and (b) the substituted silsesquioxane-based particles are substituted only with one or more than one moiety selected from a group consisting of alkyl, aryl, hydroxyl, trace amounts of alkoxy and combinations thereof and contain 50 mole-percent or less hydroxyl substitution in the form silanol functionalities relative to moles of substituted silsesquioxane-based particle as determined by infrared spectroscopy.

A molding composition formulation is provided of a thermoset cross-linkable polyol having unsaturated backbone comprising the structure defined by formula 1: (1) a reinforcing filler; and optionally, a flame retardant, a UV stabilizer or a composition comprising one of the foregoing. ##STR00001##

A molding composition formulation is provided of a thermoset cross-linkable polyol having unsaturated backbone comprising the structure defined by formula 1: (1) a reinforcing filler; and optionally, a flame retardant, a UV stabilizer or a composition comprising one of the foregoing. ##STR00001##

A liquid crystal polyester composition contains: a liquid crystal polyester in an amount of 100 parts by mass as well as a fibrous filler and a plate-like filler in an amount of not less than 65 parts by mass and not more than 100 parts by mass in total. The fibrous filler in the composition has a number average fiber diameter of not less than 5 μm and not more than 15 μm and a number average fiber length of more than 200 μm and less than 400 μm. The mass ratio of the fibrous filler to the plate-like filler in the composition is not less than 3 and not more than 15. The flow starting temperature of the composition is not lower than 250° C. and lower than 314° C.