In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

Disclosed herein are curable compositions comprising an epoxide-functional polymer and a curing agent that reacts with the epoxide-functional polymer that is activatable by an external energy source. The epoxide-functional polymer may be a solid a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

Disclosed herein are curable compositions comprising an epoxide-functional polymer and a curing agent that reacts with the epoxide-functional polymer that is activatable by an external energy source. The epoxide-functional polymer may be a solid a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

The present invention relates to a waterproof component that is an insert molded body formed from a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition contains a thermoplastic resin (A) and an inorganic filler (B); the content of the inorganic filler (B) is 8 to 130 parts by mass based on 100 parts by mass of the thermoplastic resin (A); the inorganic filler (B) is at least either one of a spherical inorganic filler (B1) and a tabular inorganic filler (B2); the spherical inorganic filler (B1) has an average particle diameter of 2 μm or more and 200 μm or less; and the tabular inorganic filler (B2) has an average particle diameter of 2 μm or more and 200 μm or less and has an average aspect ratio of 10 or more and 200 or less.

The present invention also relates to an electronic device provided with the same.

The present invention relates to a waterproof component that is an insert molded body formed from a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition contains a thermoplastic resin (A) and an inorganic filler (B); the content of the inorganic filler (B) is 8 to 130 parts by mass based on 100 parts by mass of the thermoplastic resin (A); the inorganic filler (B) is at least either one of a spherical inorganic filler (B1) and a tabular inorganic filler (B2); the spherical inorganic filler (B1) has an average particle diameter of 2 μm or more and 200 μm or less; and the tabular inorganic filler (B2) has an average particle diameter of 2 μm or more and 200 μm or less and has an average aspect ratio of 10 or more and 200 or less.

The present invention also relates to an electronic device provided with the same.

The present invention relates to a waterproof component that is an insert molded body formed from a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition contains a thermoplastic resin (A) and an inorganic filler (B); the content of the inorganic filler (B) is 8 to 130 parts by mass based on 100 parts by mass of the thermoplastic resin (A); the inorganic filler (B) is at least either one of a spherical inorganic filler (B1) and a tabular inorganic filler (B2); the spherical inorganic filler (B1) has an average particle diameter of 2 μm or more and 200 μm or less; and the tabular inorganic filler (B2) has an average particle diameter of 2 μm or more and 200 μm or less and has an average aspect ratio of 10 or more and 200 or less.

The present invention also relates to an electronic device provided with the same.

Embodiments herein include compositions, extruded articles, and methods of making the same. In an embodiment, an extruded article is included. The extruded article can include an extruded segment comprising a first composition. The first composition can include a polymer resin, particles and fibers. The fibers can be disposed within the first composition exhibiting a substantially non-aligned directional orientation. In an embodiment, an extruded article is included having a first portion comprising a first composition having a first fiber orientation and a second portion comprising a second composition having a second fiber orientation. The first composition can include a polymer resin and fibers. The second composition can include a polymer resin, particles and fibers. The fibers of the second composition can be oriented more randomly than the fibers of the first composition. Other embodiments are also included herein.

Embodiments herein include compositions, extruded articles, and methods of making the same. In an embodiment, an extruded article is included. The extruded article can include an extruded segment comprising a first composition. The first composition can include a polymer resin, particles and fibers. The fibers can be disposed within the first composition exhibiting a substantially non-aligned directional orientation. In an embodiment, an extruded article is included having a first portion comprising a first composition having a first fiber orientation and a second portion comprising a second composition having a second fiber orientation. The first composition can include a polymer resin and fibers. The second composition can include a polymer resin, particles and fibers. The fibers of the second composition can be oriented more randomly than the fibers of the first composition. Other embodiments are also included herein.

The present invention provides a tin-free, room temperature curable silicone elastomer composition, wherein the uncured composition is a putty. The silicone elastomer composition comprises a) an end-capped base polymer, wherein the base polymer comprises a polysiloxane or mixture of polysiloxanes, and wherein the end-capped base polymer comprises terminal di-(C.sub.1-4)alkoxy silyl groups; b) at least one amorphous filler; c) 15.1 to 60 parts by weight of at least one spherical filler for each 100 parts by weight of base polymer; and d) a curing catalyst consisting of one or more selected from the group consisting of organic titanates and organic zirconates. The terminal dialkoxy silyl groups of the base polymer can be dimethoxy silyl groups. The at least one amorphous filler can be selected from the group consisting of fumed silica, fumed alumina, carbon black, precipitated silica, precipitated calcium carbonate, surface-treated calcium carbonate and mixtures thereof.