C08K7/20

GLASS FILLER POWDER

A glass filler powder includes a bubble therein, a volume fraction of the bubble being from 0.2% to 2%.

COMPOSITION AND PRODUCTION METHOD FOR 3D PRINTING CONSTRUCTION MATERIAL

A composition of 3D printable photocurable material can include acrylate monomer(s) between about 0-30.0 composition wt %; acrylate oligomer(s) between about 0-30.0 composition wt %; photoinitiator(s) between about 0.02-1.0 composition wt %; chopped fiber(s) between about 0.1-3.0 composition wt %; flame retardant(s) between about 2.0-20.0 composition wt %; processing aid(s) between about 0.05-3.0 composition wt %; additive(s) between about composition 0-3.0 wt %; and filler(s) between about 20.0-80.0 composition wt %. The composition can have a viscosity of about 10,000-300,000 mPa.Math.s, can be configured to be extruded at a printing speed of about 7-90 cm.sup.3/s during 3D printing, can be photopolymerized under UV or visible irradiation at a material depth of about 4-8 mm, and can be cured to form a building construction material.

COMPOSITION AND PRODUCTION METHOD FOR 3D PRINTING CONSTRUCTION MATERIAL

A composition of 3D printable photocurable material can include acrylate monomer(s) between about 0-30.0 composition wt %; acrylate oligomer(s) between about 0-30.0 composition wt %; photoinitiator(s) between about 0.02-1.0 composition wt %; chopped fiber(s) between about 0.1-3.0 composition wt %; flame retardant(s) between about 2.0-20.0 composition wt %; processing aid(s) between about 0.05-3.0 composition wt %; additive(s) between about composition 0-3.0 wt %; and filler(s) between about 20.0-80.0 composition wt %. The composition can have a viscosity of about 10,000-300,000 mPa.Math.s, can be configured to be extruded at a printing speed of about 7-90 cm.sup.3/s during 3D printing, can be photopolymerized under UV or visible irradiation at a material depth of about 4-8 mm, and can be cured to form a building construction material.

RETROREFLECTIVE AQUEOUS PSEUDOPLASTIC GEL COMPOSITION FOR INDUSTRIAL SPRAYING

The invention relates to an aqueous pseudoplastic gel composition, having a first viscosity η.sub.1 at a shear rate of 0.01 s.sup.−1 of between 5 and 200 Pa.Math.s and a second viscosity η.sub.2 at a shear rate of 100 s.sup.−1 that is between 10 and 1000 times lower than the first viscosity, wherein the aqueous pseudoplastic gel consists of, based on the total weight of the composition: 15-60 wt. % of water; 20-60 wt. % of spherical glass beads having a median particle diameter D50, as measured with laser diffraction, between 5 and 150 μm, and a refractive index, measured at a wavelength λ of 589 nm, between 1.8 and 2.8; 0.15-1.5 wt. % of a thickener; and 0-50 wt. % of one or more further ingredients.

The invention further relates to methods for its preparation. The invention further concerns a process for coating a substrate with a retroreflective layer using said aqueous pseudoplastic gel composition and to substrates coated with a retroreflective layer obtainable by said process.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Temporary protection for heat treatable coated glass articles
11753333 · 2023-09-12 · ·

A temporary protective coating for heat treatable coated glass article includes acrylic monomers or solid particle reinforced acrylic monomers is disclosed. The temporary protective coating of the present disclosure is completely devoid of oligomeric acrylates. The temporary protective coating is applied directly over a functionally coated transparent substrate to protect the coated substrate during heat treatment and handling of the coated substrate before heat treatment. The temporary protective coating is completely removed during the heat treatment leaving behind no residues thereby keeping the physical properties of the functionally coated substrate intact.

Modified formula for hydrophilic foam
11753514 · 2023-09-12 · ·

The present invention provides a modified formula to make a hydrophilic foam. In some embodiments this modified formula adds a filler which causes the foam to become less absorptive, which has the benefit of making available to the skin more makeup or other products, while also providing a superior esthetic application of makeup on the skin. In other embodiments the modified formula makes the hydrophilic foam easier to clean and reduces the staining propensity of the foam. In other embodiments the modified formula uses an additive to the properties or usability of the foam in some way. Providing the filler and additive can be done in combination or separately depending on the desired benefits or properties of the foam. In some embodiments the foam is fashioned into a shape suitable for makeup application.

Modified formula for hydrophilic foam
11753514 · 2023-09-12 · ·

The present invention provides a modified formula to make a hydrophilic foam. In some embodiments this modified formula adds a filler which causes the foam to become less absorptive, which has the benefit of making available to the skin more makeup or other products, while also providing a superior esthetic application of makeup on the skin. In other embodiments the modified formula makes the hydrophilic foam easier to clean and reduces the staining propensity of the foam. In other embodiments the modified formula uses an additive to the properties or usability of the foam in some way. Providing the filler and additive can be done in combination or separately depending on the desired benefits or properties of the foam. In some embodiments the foam is fashioned into a shape suitable for makeup application.