There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm.sup.2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm.sup.2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

The invention relates to a thermoplastic molding composition comprising 5.0 to 57 wt.-% ABS graft copolymer (A); 30.5 to 80 wt.-% SAN copolymer (B) 1.5 to 9.5 wt.-% copolymer (C) with epoxy, maleic anhydride or maleic imide functions; 5 to 29 wt.-% of hollow glass microspheres (D); 6 to 12 wt.-% of glass fibers (E); 0 to 5 wt.-% additives and/or processing aids (F), having a low density and high strength, and a process for its preparation, shaped arti-cles thereof, and its use in the electronics sector.

The invention relates to a thermoplastic molding composition comprising 5.0 to 57 wt.-% ABS graft copolymer (A); 30.5 to 80 wt.-% SAN copolymer (B) 1.5 to 9.5 wt.-% copolymer (C) with epoxy, maleic anhydride or maleic imide functions; 5 to 29 wt.-% of hollow glass microspheres (D); 6 to 12 wt.-% of glass fibers (E); 0 to 5 wt.-% additives and/or processing aids (F), having a low density and high strength, and a process for its preparation, shaped arti-cles thereof, and its use in the electronics sector.

A product including ultrafine natural glass, methods of producing the ultrafine natural glass, and methods of use thereof are provided. The product may have, for example, a small top cut (d.sub.99) particle size of, for example, less than 12 microns. The product may also have high blue light brightness higher than, for example, 69, and/or low oil absorption, for example, less than 100 percent in volume. The product may be used in a variety of applications, such as, for example, anti-block filler in plastic films and/or reinforcement filler in polymers.

A product including ultrafine natural glass, methods of producing the ultrafine natural glass, and methods of use thereof are provided. The product may have, for example, a small top cut (d.sub.99) particle size of, for example, less than 12 microns. The product may also have high blue light brightness higher than, for example, 69, and/or low oil absorption, for example, less than 100 percent in volume. The product may be used in a variety of applications, such as, for example, anti-block filler in plastic films and/or reinforcement filler in polymers.

A thin plate molding material includes a resin composition containing a resin component and a filling material, and a reinforced fiber with a predetermined fiber length. The content ratio of the reinforced fiber is a predetermined ratio. The mixing ratio of the resin component is a predetermined ratio.

Embodiments of a curable formaldehyde-free resin, and a method for the manufacture of the curable formaldehyde-free resin are provided herein. The curable formaldehyde-free resin is provided in the form of an aqueous dispersion. The curable formalde-hyde-free resin comprises component a) a reducing sugar, component b) a polycarboxylic acid, component c) one or more polyols having a molecular weight of less than 1000 g/mol, and component d) epoxysilane. The total amount of component c) in the curable formaldehyde-free resin is between 0.5 and 10% wt. with respect to the sum of components a) and b). The amount of component d) is from 0.1% wt. to less than or equal to 2% wt. with respect to the sum of components a) and b). Further, a method for the manufacture of the curable formaldehyde-free resin according to one of the embodiments of the present disclosure is provided.

Embodiments of a curable formaldehyde-free resin, and a method for the manufacture of the curable formaldehyde-free resin are provided herein. The curable formaldehyde-free resin is provided in the form of an aqueous dispersion. The curable formalde-hyde-free resin comprises component a) a reducing sugar, component b) a polycarboxylic acid, component c) one or more polyols having a molecular weight of less than 1000 g/mol, and component d) epoxysilane. The total amount of component c) in the curable formaldehyde-free resin is between 0.5 and 10% wt. with respect to the sum of components a) and b). The amount of component d) is from 0.1% wt. to less than or equal to 2% wt. with respect to the sum of components a) and b). Further, a method for the manufacture of the curable formaldehyde-free resin according to one of the embodiments of the present disclosure is provided.

The present invention provides polyamide compositions comprising (a) at least one polyamide mixture; (b) at least one reinforcing filler; (c) at least one heat stabilizer; and (d) at least one ionic lubricant, wherein the (a) at least one polyamide mixture is formed from (i) a polyamide 6,6, the amount of AEG being greater than the amount of CEG, and (ii) a blend of a first high chain-length polyamide having viscosity number (VN) of X.sub.1 and a second high chain-length polyamide having VN of X.sub.2, X.sub.1 being greater than X.sub.2. The polyamide composition can be advantageously used to produce articles exhibiting enhanced chemical resistance, notably CaCl.sub.2 salt crack resistance, such as radiator end tank in an automobile.