A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A mouse pad structure (10) includes a pad (1) and an oleophobic film (2), and the pad (1) has an upper surface (11), and the oleophobic film (11) is adhered to the upper surface (11). The oleophobic film (11) includes a plastic substrate (21) and multiple glass microbeads (22) scattered in the plastic substrate (21), so that the mouse pad structure (10) may have a smooth surface and the effects of resisting oil stains and fingerprints and enhancing the aesthetic appearance of a mouse pad.

A mouse pad structure (10) includes a pad (1) and an oleophobic film (2), and the pad (1) has an upper surface (11), and the oleophobic film (11) is adhered to the upper surface (11). The oleophobic film (11) includes a plastic substrate (21) and multiple glass microbeads (22) scattered in the plastic substrate (21), so that the mouse pad structure (10) may have a smooth surface and the effects of resisting oil stains and fingerprints and enhancing the aesthetic appearance of a mouse pad.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

The invention relates to compositions, molding materials producible from the compositions, and to articles of manufacture in turn based on the molding materials, wherein the compositions comprise polyalkylene terephthalate or polyalkylene furanoate, at least one filler or reinforcer, and at least one secondary alkanesulfonate having two alkyl radicals.

The invention relates to compositions, molding materials producible from the compositions, and to articles of manufacture in turn based on the molding materials, wherein the compositions comprise polyalkylene terephthalate or polyalkylene furanoate, at least one filler or reinforcer, and at least one secondary alkanesulfonate having two alkyl radicals.

The present invention relates to a retroreflective yarn coated with a composition for coating yarn comprising glass beads and an aqueous thermosetting urethane resin, and a method for producing the same.

The retroreflective yarn according to the present invention achieves a retroreflective function with high durability and high brightness.

A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm.sup.3.